About: *Research and development of advanced silicon wafer for sub-micron technologies.     Goto   Sponge   NotDistinct   Permalink

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  • *The development of advanced silicon wafer technology for production of high-tech integrated circuits with sub-micron detail. In order to reach these goals, we are going to install a new hot zone with diameter 450 mm for Czochralski pulling of silicon single crystals which will reduce the gap between technology level of Czech silicon single crystal manufacturer and world leading producers. (en)
  • *Výzkum a vývoj technologie výroby pokročilé leštěné desky pro high-tech sub-mikronové technologie výroby integrovaných obvodů. Pro dosažení daných cílů vývoje pokročilé desky bude v procesu Czochralskiho tažení monokrystalů křemíku instalována nová topná zóna průměru 450 mm a sníží se rozdíl mezi úrovní technologie výroby monokrystalů křemíku v ČR a u vedoucích firem v oboru.
Title
  • *Research and development of advanced silicon wafer for sub-micron technologies. (en)
  • *Výzkum a vývoj pokročilé křemíkové desky pro sub-mikronové technologie.
skos:notation
  • FI-IM2/131
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  • advanced silicon wafer; crystal growth; Czochralski; FEMAG; integrated circuits; semiconductor; silicon; silicon wafer (en)
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  • Vyvinuta technologie výroby pokročilé křemíkové desky (ASiW) průměru 150 mm pro sub-mikronové aplikace. Zhotoveny prototypy ASiW a vzorky desek průměru 200 mm. S pomocí CAD nástrojů (simulace) vyvinut proces růstu krystalů v 18%22 topné zóně. (cs)
  • Production technology for the advanced 6%22 Si wafers (ASiW) for sub-micron applications was developed. ASiW prototypes and the samples of 8%22 wafers were produced. Crystal growth process in 18%22 hot zone was developed with support of the advanced CAD tools. (en)
http://linked.open...tniCyklusProjektu
http://linked.open.../cep/klicoveSlovo
  • Czochralski
  • FEMAG
  • crystal growth
  • integrated circuits
  • semiconductor
  • silicon
  • advanced silicon wafer
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