About: The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The article treats creep-fatigue models used for lifetime estimate of solder joints. It also states the results of practical measurement (with the use of BGA parts) and the theoretical computation of the lifetime of solder joints soldered with lead-free solder SAC 305. In order to obtain experimental data, the test sample is repeatedly exposed to temperatures ranging from -20 to +100 centigrade, with a dwell time of 15 minutes at maximum and minimum temperature. The experiment is still in progress. In this article, the experimental results of the research will be confronted with the theoretical computations The article treats creep-fatigue models used for lifetime estimate of solder joints. It also states the results of practical measurement (with the use of BGA parts) and the theoretical computation of the lifetime of solder joints soldered with lead-free solder SAC 305. In order to obtain experimental data, the test sample is repeatedly exposed to temperatures ranging from -20 to +100 centigrade, with a dwell time of 15 minutes at maximum and minimum temperature. The experiment is still in progress. In this article, the experimental results of the research will be confronted with the theoretical computations (en)
Title	The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction (en)
skos:prefLabel	The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction (en)
skos:notation	RIV/00216305:26220/10:PU86819!RIV11-MPO-26220___
http://linked.open...avai/riv/aktivita	P
http://linked.open...avai/riv/aktivity	P(FR-TI1/072)
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Novotný, Václav Švecová, Olga
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	294657
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/10:PU86819
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Creep-fatigue models, lead-free solder, solder joint, BGA. (en)
http://linked.open.../riv/klicoveSlovo	lead-free solder solder joint BGA. Creep-fatigue models
http://linked.open...ontrolniKodProRIV	[5FDDD9213FAB]
http://linked.open...v/mistoKonaniAkce	Izhevsk
http://linked.open...i/riv/mistoVydani	Izhevsk, Russia
http://linked.open...i/riv/nazevZdroje	SECOND FORUM OF YOUNG RESEARCHERS In the framework of International Forum %22Education Quality 2010%22
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...vavai/riv/projekt	Use of Modern Assembly Techniques and Materials in Electronic Industry
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Švecová, Olga Novotný, Václav
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2010-04-21 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Publishing House of ISTU
https://schema.org/isbn	978-5-7526-0442-3
http://localhost/t...ganizacniJednotka	26220
is http://linked.open...avai/riv/vysledek of	The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction

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