About: Lead Free Solder Material Compatibility and Technological Factors     Goto   Sponge   NotDistinct   Permalink

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Description
  • Tento článek se zabývá výzkumem nanášení bezolovnaté pájky a její následné smáčivosti během pájecího procesu. V experimentu se porovnávají pájky SA a SAC s olovnatou pájkou SnPb. Pro vyhodnocení výsledkú této studie byla použita metoda DOE. (cs)
  • This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study
  • This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study (en)
Title
  • Lead Free Solder Material Compatibility and Technological Factors
  • Lead Free Solder Material Compatibility and Technological Factors (en)
  • Kompatibilita bezolovnatých pájek a jejich technologické vlastnosti (cs)
skos:prefLabel
  • Lead Free Solder Material Compatibility and Technological Factors
  • Lead Free Solder Material Compatibility and Technological Factors (en)
  • Kompatibilita bezolovnatých pájek a jejich technologické vlastnosti (cs)
skos:notation
  • RIV/00216305:26220/05:PU50169!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany
  • 78-83
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/04/0590), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 527870
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/05:PU50169
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • lead free, solderability, wettability, surface finish, flux, DOE (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [A3569A9B2301]
http://linked.open...v/mistoKonaniAkce
  • Wiener Neustadt
http://linked.open...i/riv/mistoVydani
  • Vienna
http://linked.open...i/riv/nazevZdroje
  • Conference Proceedings ISSE 2005
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Starý, Jiří
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Neuveden
https://schema.org/isbn
  • 0-7803-9325-2
http://localhost/t...ganizacniJednotka
  • 26220
is http://linked.open...avai/riv/vysledek of
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