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Description
  • Příspěvek je zaměřen na termomechaniké modelování dvou substrátů s různým CTE. Jedním z materiálů je laminát FR4, druhým je keramika 96% Al2O3. Spojení substrátů je zajištěno pomocí spojů realizovaných bezolovnatou pájkou SnAgCu. Cílem je popsat vliv rozměrů a tvaru pájených spojů na mechanické napětí v struktuře vznikající. (cs)
  • This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.
  • This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading. (en)
Title
  • Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani (cs)
  • Optimizing of Solder Joint Reliability by 3D Modeling
  • Optimizing of Solder Joint Reliability by 3D Modeling (en)
skos:prefLabel
  • Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani (cs)
  • Optimizing of Solder Joint Reliability by 3D Modeling
  • Optimizing of Solder Joint Reliability by 3D Modeling (en)
skos:notation
  • RIV/00216305:26220/04:PU43642!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany
  • 195-394
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/04/0590), Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 578344
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/04:PU43642
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • solder joint reliability, modelling, ANSYS (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [6E7CB830336D]
http://linked.open...v/mistoKonaniAkce
  • Prague
http://linked.open...i/riv/mistoVydani
  • Lanskroun
http://linked.open...i/riv/nazevZdroje
  • Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Bulva, Jindřich
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • IMAPS CZ&SK Chapter
https://schema.org/isbn
  • 80-239-2835-X
http://localhost/t...ganizacniJednotka
  • 26220
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