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  • This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed.
  • This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. (en)
Title
  • Study of the components self-alignment in surface mount technology
  • Study of the components self-alignment in surface mount technology (en)
skos:prefLabel
  • Study of the components self-alignment in surface mount technology
  • Study of the components self-alignment in surface mount technology (en)
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  • RIV/68407700:21230/12:00199211!RIV13-MSM-21230___
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  • S
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  • 172214
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  • RIV/68407700:21230/12:00199211
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  • reflow soldering; surface mount technology; components placement offset (en)
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  • [FD5F4E8B9277]
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  • Bad Aussee
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  • Wien
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  • 35th International Spring Seminar on Electronics Technology
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  • Dušek, Karel
  • Novák, M.
  • Rudajevová, A.
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number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2012.6273138
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  • Technische Universität
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  • 978-1-4673-2241-6
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  • 21230
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