About: *MERIT - Measurement environment for the reliability study of interconnection technologies.     Goto   Sponge   NotDistinct   Permalink

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Description
  • *Vývoj a výroba prototypu testovacího systému využitelného pro výzkum spolehlivosti v integrovaných obvodech a plošných spojích. Zvláštní důraz je kladen na spolehlivost propojení ve vysokém proudu až do 10 A nebo více. Testovací systém se skládá ze specializovaného hardwaru a softwaru pro údržbu databází a analýzu dat. (cs)
  • *In this project a test system to be used in investigation and research on reliability of interconnections in integrated circuits and printed circuit boards will be developed and realised. Especially the reliability of interconnections of semmiconductor chips under high current regime until 10 A or more, is emphasised. The test system consists of dedicated hardware, software for database management and for data analysis. (en)
Title
  • *MERIT - Measurement environment for the reliability study of interconnection technologies. (en)
  • *MERIT - Výzkum nových technologií pro kontaktování čipů integrovaných obvodů a vývoj měřicího systému pro analýzu spolehlivosti. (cs)
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  • reliability and ageing of eletrical joints; high current; test system; test equipment; test chip; hardware; software; database of functional blocks; packing and interconnections (en)
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