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Description
  • Článek se zabývá modelováním tepelně-mechanických vlastností multisubstrátových struktur. Je zaměřen na porovnání 2D a 3D modelů, popisujících mechanické napětí vznikající ve spojích mezi organickým substrátem FR4 a keramikou. (cs)
  • This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices - FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connectedwith eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.
  • This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices - FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connectedwith eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after. (en)
Title
  • Comparing of 2D and 3D Modeling of MSM
  • Comparing of 2D and 3D Modeling of MSM (en)
  • Srovnání 2D a 3D moledování MSM (cs)
skos:prefLabel
  • Comparing of 2D and 3D Modeling of MSM
  • Comparing of 2D and 3D Modeling of MSM (en)
  • Srovnání 2D a 3D moledování MSM (cs)
skos:notation
  • RIV/00216305:26220/05:PU47305!RIV06-GA0-26220___
http://linked.open.../vavai/riv/strany
  • 1-3
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/04/0590), Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 515806
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/05:PU47305
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • ANSYS, solder joint reliability (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [88DFAE6C97B2]
http://linked.open...v/mistoKonaniAkce
  • Tarragona
http://linked.open...i/riv/mistoVydani
  • Tarragona, Spain
http://linked.open...i/riv/nazevZdroje
  • 2005 Spanish Conference on Electron Devices
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Bulva, Jindřich
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • IEEE
https://schema.org/isbn
  • 0-7803-8811-9
http://localhost/t...ganizacniJednotka
  • 26220
is http://linked.open...avai/riv/vysledek of
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