. "This work deals with estimation of the bond strength on the as-bonded interface by the razor blade test. The results are discussed with respect to the quality of the final SOI wafer. The effect of pre-bonding plasma activation of wafer surface in various gases as well as the effect of hydrophilicity or hydrophobicity of the surfaces is discussed." . . "978-80-970896-5-8" . "P(TA01010078)" . "65"^^ . . . . . "69800" . . "RIV/26821532:_____/13:#0000072" . . "1"^^ . . "1"^^ . "[4101C81EF17B]" . "SOI, Silicon-On-Insulator, Bonding, Silicon, Semiconductor, Bonding"@en . "Direct wafer bonding for SOI"@en . . "Ke\u017Emarsk\u00E9 \u017D\u013Eaby. Slovensk\u00E1 republika" . . "CSACG" . "V\u00E1lek, Luk\u00E1\u0161" . "Direct wafer bonding for SOI" . . "This work deals with estimation of the bond strength on the as-bonded interface by the razor blade test. The results are discussed with respect to the quality of the final SOI wafer. The effect of pre-bonding plasma activation of wafer surface in various gases as well as the effect of hydrophilicity or hydrophobicity of the surfaces is discussed."@en . . . "Direct wafer bonding for SOI"@en . "RIV/26821532:_____/13:#0000072!RIV14-TA0-26821532" . "2013-01-01+01:00"^^ . . . . . "Direct wafer bonding for SOI" . "Proceedings of 23rd Joint Seminar %22Development of Materials Science in Research and Education%22" . . "Bratislava, Slovensk\u00E1 republika." .