"TECON Scientific, spol. s r. o." . "Novel water based cutting fluids for saw technology"@en . "Lap\u010D\u00EDk, Lubom\u00EDr" . "Proceedings of the 12 th Scientific and Business Conference SILICON 2010" . "8"^^ . "Novel water based cutting fluids for saw technology" . "2"^^ . "saw cutting; coolant; water based slurries; silicon"@en . "3"^^ . "Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC) in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System\u00B4s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning of modern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of the system for la"@en . "2010-01-01+01:00"^^ . . . . . . "S" . "RIV/70883521:28110/10:63509272" . . "28110" . . . . . "[29637D88C3D7]" . . "RIV/70883521:28110/10:63509272!RIV11-MSM-28110___" . "Ro\u017Enov pod Radho\u0161t\u011Bm" . "Ro\u017Enov pod Radho\u0161t\u011Bm" . . . . "Novel water based cutting fluids for saw technology"@en . "978-80-254-7361-0" . "Vojt\u011Bchovsk\u00FD, Karel" . "Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC) in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System\u00B4s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning of modern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of the system for la" . . "275459" . . "Novel water based cutting fluids for saw technology" . .