"3"^^ . . "9788021447547" . "solder alloys; thermal capacity; wetting balance method"@en . . "MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY" . "Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert \u2013 nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm."@en . "R\u016F\u017Ei\u010Dka, Daniel" . . "MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY" . "86756" . . "MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY"@en . . "Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert \u2013 nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm." . "21230" . "RIV/68407700:21230/13:00210400!RIV14-MSM-21230___" . . . . . . "Beshajov\u00E1 Pelik\u00E1nov\u00E1, Ivana" . "Du\u0161ek, Karel" . "Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B. Fakulta elektrotechniky a komunika\u010Dn\u00EDch technologi\u00ED" . . "S" . "Proceedings - Electronic Devices and Systems - EDS '13" . "Brno" . "Brno" . . . "3"^^ . . . "MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY"@en . "[167994CB1D28]" . . . "RIV/68407700:21230/13:00210400" . "4"^^ . "2013-06-26+02:00"^^ . .