. "21230" . "This work presents a precious thermo-mechanical simulation and characterization of designed LED board used for retrofit solid state lightening (SSL) lamp. Work focuses on a determination of a thermo-mechanical behavior during thermal cycling tests performed in a test chamber. Because of high thermal cycling range (-20...125 \u00B0C) precious creep including elastic-plastic analysis has to be done. In the first step a transient thermo-mechanical simulation of detailed LED board model was done. Critical parts of the structure from reliability point of view were found. The second part of work aims to predict the lifetime of LED board for SSL lamp exposed to thermal cycling tests done in a thermal chamber with the specified temperature profile." . . "Jakovenko, Ji\u0159\u00ED" . "Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp"@en . . "S" . "Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp" . . "6"^^ . "Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp"@en . . . . . . "1"^^ . . "RIV/68407700:21230/13:00206298!RIV14-MSM-21230___" . "Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B. Fakulta elektrotechniky a komunika\u010Dn\u00EDch technologi\u00ED" . . . . "2"^^ . . "2013-06-26+02:00"^^ . . "http://www.imaps.cz/eds/" . "88937" . . . . . "[311B9C672D28]" . . "RIV/68407700:21230/13:00206298" . . "Brno" . "SSL; LED board; thermal cycling; simulation; measurement; elastic-plastic analysis; stress; lifetime; solder; creep; Schubert model"@en . . "Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp" . "Brno" . . "Proceedings - Electronic Devices and Systems - EDS '13" . "This work presents a precious thermo-mechanical simulation and characterization of designed LED board used for retrofit solid state lightening (SSL) lamp. Work focuses on a determination of a thermo-mechanical behavior during thermal cycling tests performed in a test chamber. Because of high thermal cycling range (-20...125 \u00B0C) precious creep including elastic-plastic analysis has to be done. In the first step a transient thermo-mechanical simulation of detailed LED board model was done. Critical parts of the structure from reliability point of view were found. The second part of work aims to predict the lifetime of LED board for SSL lamp exposed to thermal cycling tests done in a thermal chamber with the specified temperature profile."@en . "9788021447547" . . "Form\u00E1nek, Jan" .