. "2011-10-20+02:00"^^ . "2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging" . "Electrically conductive adhesive based on epoxy resin matrix with silver filler was used for formation of adhesive joints, which were aged at the higher temperature and humidity. Resistance and nonlinearity of current vs. voltage characteristic were measured and results found before and after ageing were compared. It was found that combined ageing causes increase of resistance and non-linearity of adhesive joints."@en . "RIV/68407700:21230/11:00184718" . . "Politehnica University of Timisoara" . "RIV/68407700:21230/11:00184718!RIV12-MSM-21230___" . "Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging"@en . . . . . . "Barto, Seba" . "Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging" . . . "Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging"@en . "Correlation; Adhesives; Aging; Resistivity; Non-Linearity"@en . . . . "Electrically conductive adhesive based on epoxy resin matrix with silver filler was used for formation of adhesive joints, which were aged at the higher temperature and humidity. Resistance and nonlinearity of current vs. voltage characteristic were measured and results found before and after ageing were compared. It was found that combined ageing causes increase of resistance and non-linearity of adhesive joints." . . . "2"^^ . "Timisoara" . "Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging" . . "Timisoara" . "21230" . . "2"^^ . "226727" . "978-1-4577-1275-3" . "2"^^ . . "Mach, Pavel" . . "[155BE891FE77]" . . "S" .