"Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives" . "3"^^ . . . "21230" . . "Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives" . . "Cinert, Jakub" . . "3"^^ . "204665" . . "RIV/68407700:21230/11:00184712!RIV12-MSM-21230___" . . "Mach, Pavel" . "Thermal Aging; ICA; ECA; Quality"@en . "Electrically conductive adhesives are environmental friendly materials for conductive joining in electronics. Adhesives based on bis-phenol epoxy resin filled with silver flakes with concentration from 65 to 80 % (by wt.) were used for experiments. Conductive joints were formed of these adhesives and thermally aged at the temperature of 120 oC. It was found that the conductivity of adhesives slightly increased after ageing." . . "2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging" . "Timisoara" . "Barto, Seba" . "Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives"@en . "Timisoara" . . "S" . . . "Electrically conductive adhesives are environmental friendly materials for conductive joining in electronics. Adhesives based on bis-phenol epoxy resin filled with silver flakes with concentration from 65 to 80 % (by wt.) were used for experiments. Conductive joints were formed of these adhesives and thermally aged at the temperature of 120 oC. It was found that the conductivity of adhesives slightly increased after ageing."@en . "[FA1511FBC780]" . . "978-1-4577-1275-3" . . "Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives"@en . . . . . . "2"^^ . . "2011-10-20+02:00"^^ . "Politehnica University of Timisoara" . "RIV/68407700:21230/11:00184712" .