. . "[16D6EFC585AD]" . "Cinert, Jakub" . . "2"^^ . "21230" . . "RIV/68407700:21230/11:00184692!RIV12-MSM-21230___" . . "Influence of Surface Finish on Resistance of Contacts between ECA and Pad"@en . "2"^^ . "Influence of Surface Finish on Resistance of Contacts between ECA and Pad" . "Mach, Pavel" . "Influence of Surface Finish on Resistance of Contacts between ECA and Pad" . "204591" . . . "978-1-4577-2111-3" . . "Technick\u00E1 univerzita v Ko\u0161iciach" . . "Influence of Surface Finish on Resistance of Contacts between ECA and Pad"@en . "Z(MSM6840770021)" . . . . . "Ko\u0161ice" . "Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol epoxy resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated and difference between contact resistances is measured. Resistances of copper and gold finishes are the lowest." . . "Tatransk\u00E1 Lomnica" . "2011-05-11+02:00"^^ . "ECA; Adhesive Joint; Joint Resistance"@en . "RIV/68407700:21230/11:00184692" . . . "34th International Spring Seminar on Electronics Technology" . "2"^^ . "Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol epoxy resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated and difference between contact resistances is measured. Resistances of copper and gold finishes are the lowest."@en . . .