. "978-1-4244-7849-1" . "2010-05-12+02:00"^^ . . . . "New York" . . . "Evaluation of tin whisker growth during thermal aging combined with mechanical stress and roughing of the surface is being observed."@en . "257938" . "Evaluation of Tin Whisker Growth"@en . "Evaluation of Tin Whisker Growth"@en . . "Evaluation of tin whisker growth during thermal aging combined with mechanical stress and roughing of the surface is being observed." . "4"^^ . "[25B8B9DA4AC7]" . . "3"^^ . "10.1109/ISSE.2010.5547281" . . "Evaluation of Tin Whisker Growth" . "Du\u0161ek, Karel" . . "4"^^ . "RIV/68407700:21230/10:00173258" . "Podzemsk\u00FD, Ji\u0159\u00ED" . . "Evaluation of Tin Whisker Growth" . . . "\u010Copjan, M." . "21230" . "Urb\u00E1nek, Jan" . "tin whisker, thermal aging, mechanical stress"@en . . . "IEEE" . . "S" . "33rd International Spring Seminar on Electronics Technology" . "Warsaw" . . "RIV/68407700:21230/10:00173258!RIV12-MSM-21230___" .