"Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B. Fakulta elektrotechniky a informatiky" . . . "Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints" . "Z(MSM6840770021)" . . . "Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints"@en . "Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints" . . . "[AD8D2C30EEF8]" . "2"^^ . . "In this article, the changes of the electrical resistance of mechanically stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) against reflow temperature profiles are compared."@en . "1"^^ . . "2009-09-02+02:00"^^ . "RIV/68407700:21230/09:00159455" . "Urb\u00E1nek, M." . "Brno" . "In this article, the changes of the electrical resistance of mechanically stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) against reflow temperature profiles are compared." . "Brno" . "http://www.imaps.cz/eds2009/" . "Du\u0161ek, Karel" . "21230" . "RIV/68407700:21230/09:00159455!RIV12-MSM-21230___" . . . "Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings" . . "5"^^ . "978-80-214-3933-7" . "Temperature profile; soldered joint; mechanical stress"@en . . "Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints"@en . . . . "319430" . .