"This article delas with image analysis of the soldered joints. resulting Images sowed several differences concerning formation and propagation of cracks in joints that underwent thermal and mechanical stress." . . . . "Z(MSM6840770021)" . . "6"^^ . . "Brno" . "Brno" . . "Du\u0161ek, Karel" . . "Image Analysis; Mechanical and Temperature stress; Soldered joints"@en . "21230" . "Cracks in Soldered Joints Subjected to Mechanical Stress" . "2008-09-10+02:00"^^ . "Urb\u00E1nek, Jan" . "Cracks in Soldered Joints Subjected to Mechanical Stress" . . "Cracks in Soldered Joints Subjected to Mechanical Stress"@en . . . . . "[F9CF49A57C29]" . "361508" . "Electronics Devices and Systems Proceedings" . . "3"^^ . "RIV/68407700:21230/08:00147978!RIV12-MSM-21230___" . . "Tu\u010Dan, Marek" . "Cracks in Soldered Joints Subjected to Mechanical Stress"@en . "Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B" . "3"^^ . . "978-80-214-3717-3" . "This article delas with image analysis of the soldered joints. resulting Images sowed several differences concerning formation and propagation of cracks in joints that underwent thermal and mechanical stress."@en . . "RIV/68407700:21230/08:00147978" . . .