. "4"^^ . "31st International Spring Seminar on Electronics Technology" . . . "mechanical stress; temperature aging; solder joints"@en . . "2008-05-07+02:00"^^ . . "2"^^ . . . "New York" . "Tu\u010Dan, Marek" . . . "2"^^ . "978-1-4244-3973-7" . . "Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance"@en . "Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance" . . . "Z(MSM6840770021)" . "Article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Mechanical stress and temperature aging can change electrical properties of the soldered joints, e.g. electrical resistance. In this article, the changes of the electrical resistance of mechanically stressed and temperature aged soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) are compared."@en . . "IEEE" . "Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance" . . . "Article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Mechanical stress and temperature aging can change electrical properties of the soldered joints, e.g. electrical resistance. In this article, the changes of the electrical resistance of mechanically stressed and temperature aged soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) are compared." . . "Du\u0161ek, Karel" . "RIV/68407700:21230/08:00147969" . "21230" . "Budapest" . "Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance"@en . "372178" . "[016E6DCC109E]" . "000272337900010" . "RIV/68407700:21230/08:00147969!RIV11-MSM-21230___" . .