. "Connector geometry; EMC of PCB; Motherboard-subboard structures; Radiated emission; Unintentional radiation; Worst-case analysis"@en . "Due to its antenna nature, subboard-on-motherboard structures act as unintentional radiators of electromagnetic fields. The magnitude of the electromagnetic emissions can exceed even the CISPR 22 limits, when high-speed signals are routed through the interboard connector. A worst-case analysis of the maximum field strength radiated from two mutually-parallel motherboard-subboard PCBs is presented in this paper. A detailed investigation of the radiation behaviour of motherboard-subboard structures leads to the conclusion that with a suitable pin configuration of the interboard connector the field emission can be considerably reduced. It is shown that further field suppression can be achieved, if grounding posts are introduced into the system design." . "Proceedings of the 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology" . "Anal\u00FDza elektromagnetick\u00E9ho vyza\u0159ov\u00E1n\u00ED struktury %22motherboard-subboard"@cs . "175;178" . . . "S" . . "Analysis of the Electromagnetic Radiation Behaviour of Motherboard-Subboard Structures" . "Leone, M." . "Analysis of the Electromagnetic Radiation Behaviour of Motherboard-Subboard Structures"@en . . "St. Petersburg" . "RIV/68407700:21230/05:03113123" . . "21230" . . "4"^^ . . . . . "Moskva" . . "IEEE" . . "V\u00E1lek, Martin" . . . "[7BBB5A915C39]" . . "Analysis of the Electromagnetic Radiation Behaviour of Motherboard-Subboard Structures" . "512120" . "RIV/68407700:21230/05:03113123!RIV08-MSM-21230___" . "Schmiedl, F." . "1"^^ . "0-7803-9374-0" . . "Anal\u00FDza elektromagnetick\u00E9ho vyza\u0159ov\u00E1n\u00ED struktury %22motherboard-subboard"@cs . "Due to its antenna nature, subboard-on-motherboard structures act as unintentional radiators of electromagnetic fields. The magnitude of the electromagnetic emissions can exceed even the CISPR 22 limits, when high-speed signals are routed through the interboard connector. A worst-case analysis of the maximum field strength radiated from two mutually-parallel motherboard-subboard PCBs is presented in this paper. A detailed investigation of the radiation behaviour of motherboard-subboard structures leads to the conclusion that with a suitable pin configuration of the interboard connector the field emission can be considerably reduced. It is shown that further field suppression can be achieved, if grounding posts are introduced into the system design."@en . "2005-06-21+02:00"^^ . "Analysis of the Electromagnetic Radiation Behaviour of Motherboard-Subboard Structures"@en . "3"^^ . "Struktura %22modul-konektor-hlavn\u00ED deska%22 se chov\u00E1 jako ne\u00FAmysln\u00FD zdroj elektromagnetick\u00E9ho pole podobn\u00FD ant\u00E9n\u011B. Vzhledem k t\u00E9to vlastnosti m\u016F\u017Ee v nejnep\u0159\u00EDzniv\u011Bj\u0161\u00EDm p\u0159\u00EDpad\u011B doj\u00EDt a\u017E k p\u0159ekro\u010Den\u00ED mezn\u00EDch hodnot ru\u0161iv\u00E9ho z\u00E1\u0159en\u00ED striktn\u011B dan\u00FDch mezin\u00E1rodn\u00EDm standardem CISPR 22 pr\u00E1v\u011B, kdy\u017E vysokorychlostn\u00ED sign\u00E1l proch\u00E1z\u00ED konektorem spojuj\u00EDc\u00EDm modul (subboard) s hlavn\u00ED deskou (motherboard). Tento \u010Dl\u00E1nek popisuje anal\u00FDzu nejnep\u0159\u00EDzniv\u011Bj\u0161\u00EDho p\u0159\u00EDpadu maxim\u00E1ln\u00ED hodnoty elektrick\u00E9ho pole emitovan\u00E9ho dv\u011Bma soub\u011B\u017En\u011B orientovan\u00FDmi deskami ti\u0161t\u011Bn\u00FDch spoj\u016F propojen\u00FDch konektorem. Detailn\u00ED studie mechanismu vyza\u0159ov\u00E1n\u00ED vede k z\u00E1v\u011Bru, \u017Ee vhodn\u00FDm geometrick\u00FDm uspo\u0159\u00E1d\u00E1n\u00EDm mezideskov\u00E9ho konektoru lze ru\u0161iv\u00E9 vyza\u0159ov\u00E1n\u00ED z\u00E1sadn\u00EDm zp\u016Fsobem redukovat. Tak\u00E9 fix\u00E1tory upev\u0148uj\u00EDc\u00ED modul na hlavn\u00ED desce mohou v\u00FDrazn\u011B p\u0159isp\u011Bt ke sn\u00ED\u017Een\u00ED vyz\u00E1\u0159en\u00E9ho ru\u0161iv\u00E9ho pole, pakli\u017Ee poskytuj\u00ED dobr\u00E9 vodiv\u00E9 spojen\u00ED mezi referen\u010Dn\u00EDm potenci\u00E1lem PCB modulu a hlavn\u00ED desky."@cs . .