. "P(IBS2041001), Z(AV0Z2041904)" . . "RIV/68081723:_____/02:07023114!RIV/2003/AV0/A07003/N" . . . . "Copper alloy; Creep; Powder processing"@en . "High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles." . . "The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses."@en . "[555D44CD7484]" . . "The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses." . . . "3"^^ . "0"^^ . "\u010Cadek, Josef" . "47" . "0"^^ . . "2"^^ . "High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles." . "CZ - \u010Cesk\u00E1 republika" . . . "0001-7043" . "Zhu, S. J." . "357;378" . . "RIV/68081723:_____/02:07023114" . "High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles."@en . . . . "647564" . "High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles."@en . "22"^^ . . "Acta Technica \u010CSAV" . "Kucha\u0159ov\u00E1, Kv\u011Bta" . "4" . .