. "11"^^ . "Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress."@en . . "The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these two temperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold stress; the contr" . "Copper alloy; Creep"@en . "The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these two temperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold stress; the contr"@en . . . "40" . . "RIV/68081723:_____/02:07023100!RIV/2003/AV0/A07003/N" . . . . "2"^^ . . "Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress." . . "0"^^ . "2"^^ . "0023-432X" . "0"^^ . . "KOVOV\u00C9 MATERI\u00C1LY" . . . "641894" . "Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress."@en . "Kucha\u0159ov\u00E1, Kv\u011Bta" . "P(IBS2041001), Z(AV0Z2041904)" . "RIV/68081723:_____/02:07023100" . . "4" . "\u010Cadek, Josef" . "[3186DAB0512D]" . . "SK - Slovensk\u00E1 republika" . . "Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress." . "231;241" . .