. "Kozelkov\u00E1, Renata" . "Kub\u00ED\u010Dek, Petr" . "V\u0159e\u0161\u0165\u00E1l, J." . "1337-6047" . "Interaction of elements in the copper / indium-tin diffusion joints at 400 and 600 \u00B0C"@en . "5"^^ . "Interaction; diffusion joints; copper-indium-tin system; phase equilibria; CALPHAD"@en . "RIV/61989100:27360/07:00016293!RIV09-MSM-27360___" . . "Dr\u00E1pala, Jarom\u00EDr" . "University Review" . "RIV/61989100:27360/07:00016293" . "8"^^ . . "Interakce prvk\u016F v difuzn\u00EDm spoji m\u011B\u010F / indium-c\u00EDn p\u0159i 400 a 600 \u00B0C"@cs . "Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 \u00B0C and 600 \u00B0C will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. We study an interaction between copper wire and indium or tin alloys in liquid state too. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, micro-hardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of" . . . "427042" . "Interaction of elements in the copper / indium-tin diffusion joints at 400 and 600 \u00B0C" . "Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 \u00B0C and 600 \u00B0C will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. We study an interaction between copper wire and indium or tin alloys in liquid state too. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, micro-hardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of"@en . . "Interakce bezolovnat\u00FDch p\u00E1jek se substr\u00E1tem m\u011Bdi p\u0159edstavuje d\u016Fle\u017Eit\u00FD fenom\u00E9n v z\u00E1le\u017Eitosti spolehlivosti p\u00E1jen\u00FDch spoj\u016F. Jsou prezentov\u00E1na nov\u00E1 experiment\u00E1ln\u00ED data popisuj\u00EDc\u00ED f\u00E1zov\u00E9 rovnov\u00E1hy v syst\u00E9mu Cu - In - Sn po dlouhodob\u00E9m difuzn\u00EDm \u017E\u00EDh\u00E1n\u00ED p\u0159i 400 \u00B0C a 600 \u00B0C. Slo\u017Een\u00ED p\u00E1jek bylo: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. Byla tak\u00E9 studov\u00E1na interakce mezi m\u011Bd\u011Bn\u00FDm dr\u00E1tem a indiem nebo slitinami c\u00EDnu v stavu kapaln\u00E9m. Byla pou\u017Eit\u00E1 metoda kalen\u00ED vzork\u016F pro zachov\u00E1n\u00ED termodynamick\u00E9 rovnov\u00E1hy po \u017E\u00EDh\u00E1n\u00ED. D\u00E1le n\u00E1sledovala metalografie, m\u011B\u0159en\u00ED mikrotvrdosti, SEM (skenovac\u00ED elektronov\u00FD mikroskop) a WDX (vlnov\u011B disperzn\u00ED rentgenov\u00E1) anal\u00FDza. Nov\u00E1 f\u00E1zov\u00E1 rovnov\u00E1\u017En\u00E1 data, spolu s daty z literatury, reprezentuj\u00ED nejl\u00E9pe existuj\u00EDc\u00ED experiment\u00E1ln\u00ED popis f\u00E1zov\u00FDch rovnov\u00E1h v zm\u00EDn\u011Bn\u00E9m syst\u00E9mu. Z\u00EDskan\u00E9 experiment\u00E1ln\u00ED v\u00FDsledky f\u00E1zov\u00FDch rovnov\u00E1h byly srovn\u00E1v\u00E1ny s termodynamick\u00FDm modelov\u00E1n\u00EDm pomoc\u00ED CALPHAD (v\u00FDpo\u010Dtem f\u00E1zov\u00FDch diagram\u016F) a dal\u0161\u00EDmi autory."@cs . . "SK - Slovensk\u00E1 republika" . . "3" . . "Interakce prvk\u016F v difuzn\u00EDm spoji m\u011B\u010F / indium-c\u00EDn p\u0159i 400 a 600 \u00B0C"@cs . . "27360" . . . . "Interaction of elements in the copper / indium-tin diffusion joints at 400 and 600 \u00B0C"@en . . . "P(OC 094), Z(MSM6198910013)" . "Kroupa, A." . "Interaction of elements in the copper / indium-tin diffusion joints at 400 and 600 \u00B0C" . "1" . . . . "1"^^ . "[751A204F2604]" . .