"Analyses of thermal barrier dynamic behavior" . "thermal barrier;termomechanics;thermography;indirect problem;computer modeling"@en . "P(LN00B084)" . "598036" . "23640" . . . . . "0-9721257-2-8" . "Analyses of thermal barrier dynamic behavior" . "1-4" . . . "4"^^ . . . . . "Vesel\u00FD, Zden\u011Bk" . "[EBEC69BEAEE5]" . "Analyses of thermal barrier dynamic behavior"@en . . "2"^^ . "Analyses of thermal barrier dynamic behavior"@en . . "Virginia Polytechnic Institute and State University" . "Honner, Milan" . "RIV/49777513:23640/03:00000111!RIV/2004/MSM/236404/N" . . . "2003-06-08+02:00"^^ . "0"^^ . . "0"^^ . "2"^^ . . "This contribution is focused to experimental and computational dynamic thermal analyses of thermal barriers. The first branch considers thermal barrier coatings. Computer modeling of thermomechanical processes are used to identify the effect of individu al layers on temperature and thermal stress. Thermal processes of coating deposition and test thermal loading are measured by thermocouples and thermography. The measurements are evaluated and generalized by means ofindirect problems computer modeling a nd experimental mathematical models. The second branch deals with thermal box-barriers. Computer modeling is used in design stage of the development to find thickness of individual layers. Thermal tests and measurements are performed in high temeprature furnace." . . "Virginia" . . "Virginia" . "This contribution is focused to experimental and computational dynamic thermal analyses of thermal barriers. The first branch considers thermal barrier coatings. Computer modeling of thermomechanical processes are used to identify the effect of individu al layers on temperature and thermal stress. Thermal processes of coating deposition and test thermal loading are measured by thermocouples and thermography. The measurements are evaluated and generalized by means ofindirect problems computer modeling a nd experimental mathematical models. The second branch deals with thermal box-barriers. Computer modeling is used in design stage of the development to find thickness of individual layers. Thermal tests and measurements are performed in high temeprature furnace."@en . "RIV/49777513:23640/03:00000111" . . "Thermal Stresses \u00B403" .