"thermal stress; lead-free solder joint, shear test; Intermetallic compound"@en . . "23220" . "10.1109/ISSE.2012.6273075" . "Vienna" . . "141457" . "Vienna University of Technology, Austria" . "Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints" . "35 th International Spring Seminar on Electronics Technology - Power Electronics" . "This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150\u00B0C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article."@en . . . . . "Steiner, Franti\u0161ek" . "Nov\u00E1k, Tom\u00E1\u0161" . . . "RIV/49777513:23220/12:43925000!RIV15-MSM-23220___" . "Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints"@en . "RIV/49777513:23220/12:43925000" . "2"^^ . . "5"^^ . . . "P(ED2.1.00/03.0094)" . "2012-05-09+02:00"^^ . "2"^^ . . "Bad Aussee, Austria" . "This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150\u00B0C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article." . . . "Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints" . . . . "Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints"@en . "2161-2528" . . "[B3B97200C6B1]" . "978-1-4673-2240-9" .