"This paper deals with the technique of bonding copper directly to ceramic. The main advantage of this method is the ability to bond almost any thickness of copper directly to a ceramic. This direct bonded substrate is useful for example for power electronics substrates because of high thermal and electrical conductivity. It can also conduct currents in order of tens of amperes."@en . . "161664" . "P\u0159\u00EDm\u00E9 bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t" . . "4"^^ . "Hromadka, Karel" . "4"^^ . "Tato pr\u00E1ce se zab\u00FDv\u00E1 technologi\u00ED p\u0159\u00EDm\u00E9ho bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t. Hlavn\u00ED v\u00FDhoda t\u00E9to metody je schopnost spojit t\u00E9m\u011B\u0159 jakoukoliv tlou\u0161\u0165ku m\u011Bd\u011Bn\u00E9 f\u00F3lie p\u0159\u00EDmo na keramiku. V\u00FDsledn\u00FD substr\u00E1t se d\u00E1 pot\u00E9 vhodn\u011B pou\u017E\u00EDt nap\u0159\u00EDklad pro v\u00FDkonov\u00E9 aplikace, kde je pot\u0159eba dos\u00E1hnout vysok\u00E9 elektrick\u00E9 i tepeln\u00E9 vodivosti substr\u00E1tu. Je mo\u017En\u00E9 p\u0159en\u00E1\u0161et proudy v \u0159\u00E1dech des\u00EDtek amp\u00E9r." . . . "P\u0159\u00EDm\u00E9 bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t"@cs . . "Direct bonded copper to ceramic substrate"@en . . "Direct bonding, copper, ceramic, high conductivity"@en . . . "RIV/49777513:23220/12:43916123" . . . . "\u0160tul\u00EDk, Ji\u0159\u00ED" . . . "S" . "23220" . . . . . "[6C2BECC2C513]" . "Tato pr\u00E1ce se zab\u00FDv\u00E1 technologi\u00ED p\u0159\u00EDm\u00E9ho bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t. Hlavn\u00ED v\u00FDhoda t\u00E9to metody je schopnost spojit t\u00E9m\u011B\u0159 jakoukoliv tlou\u0161\u0165ku m\u011Bd\u011Bn\u00E9 f\u00F3lie p\u0159\u00EDmo na keramiku. V\u00FDsledn\u00FD substr\u00E1t se d\u00E1 pot\u00E9 vhodn\u011B pou\u017E\u00EDt nap\u0159\u00EDklad pro v\u00FDkonov\u00E9 aplikace, kde je pot\u0159eba dos\u00E1hnout vysok\u00E9 elektrick\u00E9 i tepeln\u00E9 vodivosti substr\u00E1tu. Je mo\u017En\u00E9 p\u0159en\u00E1\u0161et proudy v \u0159\u00E1dech des\u00EDtek amp\u00E9r."@cs . "P\u0159\u00EDm\u00E9 bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t" . . "Kroupa, Michael" . . "P\u0159\u00EDm\u00E9 bondov\u00E1n\u00ED m\u011Bdi na keramick\u00FD substr\u00E1t"@cs . "Ham\u00E1\u010Dek, Ale\u0161" . "Direct bonded copper to ceramic substrate"@en . "RIV/49777513:23220/12:43916123!RIV13-MSM-23220___" .