. "4"^^ . "Brno" . . "Brno" . . "Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B" . "Z(MSM4977751310)" . "Star\u00FD, Ji\u0159\u00ED" . "Solderability Dependence on Surface Roughness" . "2"^^ . "[D9FE9D457F85]" . "Solderability Dependence on Surface Roughness" . "Surface roughness; solderability; wetting force; wetting balance test"@en . . "978-80-214-3933-7" . . . . . . "23220" . "Nov\u00E1k, Tom\u00E1\u0161" . "EDS '09 IMAPS CS international conference proceedings" . "RIV/49777513:23220/09:00501678!RIV10-MSM-23220___" . "Stejskal, Petr" . . "RIV/49777513:23220/09:00501678" . "Solderability Dependence on Surface Roughness"@en . "6"^^ . . "342259" . "The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester."@en . . . . "The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester." . "2009-09-03+02:00"^^ . . . . "Solderability Dependence on Surface Roughness"@en . "Steiner, Franti\u0161ek" . .