. . . . "Dynamic mechanical analysis; epoxy resin; composite; printed circuit board; activation energy; Arrhenius plot"@en . "Prosr, Pavel" . "28" . . "Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate"@en . . "GB - Spojen\u00E9 kr\u00E1lovstv\u00ED Velk\u00E9 Brit\u00E1nie a Severn\u00EDho Irska" . "4"^^ . . "23220" . "9"^^ . "4" . "RIV/49777513:23220/09:00501558" . . . "4"^^ . . . "Mentl\u00EDk, V\u00E1clav" . "Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate" . . . . . . "000266856700010" . . "Z(MSM4977751310)" . "An influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex? FR-4 glass fibre einforced epoxy laminate (used for printed circuit boards manufacturing) was used for the purpose of the experiment. Composite was exposed to thermal treatment at the temperatures from 170 to 200 \u00B0C for the time of 10 ? 480 hours. Glass transition (Tg) was analyzed via dynamic mechanical analysis (DMA). It has been proved that glass transition temperature rapidly decreases in reaction to thermal stress. Obtained Tg data were used for Arrhenius plots for different critical temperatures (Tg-crit. = 105 ?120 \u00B0C). From their slopes (-Ea/R) the activation energy of the thermal degradation process was calculated as 75,5 kJ/mol. DMA recorded besides this main relaxation mechanism also one smaller relaxation process in the most aged samples. Microscopic analysis of sample?s structure showed the presence of expressive germs of degradation both on the surface"@en . . "319410" . . "An influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex? FR-4 glass fibre einforced epoxy laminate (used for printed circuit boards manufacturing) was used for the purpose of the experiment. Composite was exposed to thermal treatment at the temperatures from 170 to 200 \u00B0C for the time of 10 ? 480 hours. Glass transition (Tg) was analyzed via dynamic mechanical analysis (DMA). It has been proved that glass transition temperature rapidly decreases in reaction to thermal stress. Obtained Tg data were used for Arrhenius plots for different critical temperatures (Tg-crit. = 105 ?120 \u00B0C). From their slopes (-Ea/R) the activation energy of the thermal degradation process was calculated as 75,5 kJ/mol. DMA recorded besides this main relaxation mechanism also one smaller relaxation process in the most aged samples. Microscopic analysis of sample?s structure showed the presence of expressive germs of degradation both on the surface" . "RIV/49777513:23220/09:00501558!RIV10-MSM-23220___" . . "0142-9418" . . "Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate" . "Polansk\u00FD, Radek" . "[BCEEA2A290F0]" . "Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate"@en . "Polymer Testing" . "Su\u0161\u00EDr, Josef" .