. "A method of forming the interlayer on the glass test substrates for gluing chips, where the surface of the glass test substrate is coated at least one layer of glass paste and then immediately after the last layer of glass paste, before the glass paste is dried, the surface of the glass pastes are dusted with fine powders from temperature-resistant material using the coating device, and then test the glass substrate dried and then fired at a temperature of 450 to 650 degree C for 5 to 20 min, and then the glass surface of the test substrate is rinsed with water or Blow air stream. The glass paste is preferably applied by screen printing to form ties."@en . . "3"^^ . . . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, kde na povrch sklen\u011Bn\u00E9ho testovac\u00EDho substr\u00E1tu se nanese alespo\u0148 jedna vrstva sklen\u011Bn\u00E9 pasty, na\u010De\u017E se bezprost\u0159edn\u011B po nanesen\u00ED posledn\u00ED vrstvy sklen\u011Bn\u00E9 pasty, d\u0159\u00EDve ne\u017E sklen\u011Bn\u00E1 pasta zaschne, povrch sklen\u011Bn\u00E9 pasty popr\u00E1\u0161\u00ED jemn\u00FDm prachem z teplotn\u011B odoln\u00E9ho materi\u00E1lu pomoc\u00ED nan\u00E1\u0161ec\u00EDho za\u0159\u00EDzen\u00ED, na\u010De\u017E se sklen\u011Bn\u00FD testovac\u00ED substr\u00E1t vysu\u0161\u00ED a pak vyp\u00E1l\u00ED p\u0159i teplot\u011B 450 a\u017E 650 stup\u0148\u016F C po dobu 5 a\u017E 20 min, na\u010De\u017E se povrch sklen\u011Bn\u00E9ho testovac\u00EDho substr\u00E1tu opl\u00E1chne vodou anebo ofoukne proudem vzduchu. Sklen\u011Bn\u00E1 pasta se v\u00FDhodn\u011B nanese s\u00EDtotiskem do tvaru pra\u017Ec\u016F." . . "Method of creating interlayer on glass testing substrate intended for sticking chips, and applying device for carrying out method"@en . . . "3"^^ . "2014-06-11+02:00"^^ . . . . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, a nan\u00E1\u0161ec\u00ED za\u0159\u00EDzen\u00ED pro prov\u00E1d\u011Bn\u00ED tohoto zp\u016Fsobu"@cs . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, a nan\u00E1\u0161ec\u00ED za\u0159\u00EDzen\u00ED pro prov\u00E1d\u011Bn\u00ED tohoto zp\u016Fsobu"@cs . "P(TA01011754)" . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, a nan\u00E1\u0161ec\u00ED za\u0159\u00EDzen\u00ED pro prov\u00E1d\u011Bn\u00ED tohoto zp\u016Fsobu" . . "Prague" . "\u0158ezn\u00ED\u010Dek, Michal" . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, a nan\u00E1\u0161ec\u00ED za\u0159\u00EDzen\u00ED pro prov\u00E1d\u011Bn\u00ED tohoto zp\u016Fsobu" . . "26220" . . "RIV/00216305:26220/14:PA21140!RIV15-TA0-26220___" . "Method of creating interlayer on glass testing substrate intended for sticking chips, and applying device for carrying out method"@en . . . . . . "[908B935F0F1B]" . . "304596" . . "57912" . "http://spisy.upv.cz/Patents/FullDocuments/304/304596.pdf" . "Zp\u016Fsob vytv\u00E1\u0159en\u00ED mezivrstvy na sklen\u011Bn\u00FDch testovac\u00EDch substr\u00E1tech, ur\u010Den\u00E9 k lepen\u00ED \u010Dip\u016F, kde na povrch sklen\u011Bn\u00E9ho testovac\u00EDho substr\u00E1tu se nanese alespo\u0148 jedna vrstva sklen\u011Bn\u00E9 pasty, na\u010De\u017E se bezprost\u0159edn\u011B po nanesen\u00ED posledn\u00ED vrstvy sklen\u011Bn\u00E9 pasty, d\u0159\u00EDve ne\u017E sklen\u011Bn\u00E1 pasta zaschne, povrch sklen\u011Bn\u00E9 pasty popr\u00E1\u0161\u00ED jemn\u00FDm prachem z teplotn\u011B odoln\u00E9ho materi\u00E1lu pomoc\u00ED nan\u00E1\u0161ec\u00EDho za\u0159\u00EDzen\u00ED, na\u010De\u017E se sklen\u011Bn\u00FD testovac\u00ED substr\u00E1t vysu\u0161\u00ED a pak vyp\u00E1l\u00ED p\u0159i teplot\u011B 450 a\u017E 650 stup\u0148\u016F C po dobu 5 a\u017E 20 min, na\u010De\u017E se povrch sklen\u011Bn\u00E9ho testovac\u00EDho substr\u00E1tu opl\u00E1chne vodou anebo ofoukne proudem vzduchu. Sklen\u011Bn\u00E1 pasta se v\u00FDhodn\u011B nanese s\u00EDtotiskem do tvaru pra\u017Ec\u016F."@cs . "RIV/00216305:26220/14:PA21140" . "glass substrate, cleaning process, thick film technology, adhesion, chips"@en . . . . "Bur\u0161\u00EDk, Martin" . "Jankovsk\u00FD, Jaroslav" . . . "\u00DA\u0159ad pr\u016Fmyslov\u00E9ho vlastnictv\u00ED" . "VUT v Brn\u011B MEAS CZ, s.r.o." .