. . . . . . "36" . "66391" . "S" . "2013" . . "Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate" . . "SK - Slovensk\u00E1 republika" . . . . . . . "Psota, Boleslav" . "[D0B171108AF1]" . . "2161-2528" . . . "Kl\u00EDma, Martin" . "5"^^ . "Szendiuch, Ivan" . "RIV/00216305:26220/13:PU105873" . . "10.1109/ISSE.2013.6648228" . "The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts." . "3"^^ . "Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate" . "26220" . . "LTCC, THT, device, joint, reliability."@en . "3"^^ . "Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate"@en . "Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics" . "The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts."@en . "Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate"@en . "RIV/00216305:26220/13:PU105873!RIV14-MSM-26220___" .