"Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B" . . . . "2013-06-26+02:00"^^ . "Brno" . . "Brno" . . "Kl\u00EDma, Martin" . "3"^^ . "wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic"@en . . "Wire-Bonds Durability in High-Temperature Applications" . . "117407" . . . "6"^^ . "Psota, Boleslav" . . "[4542346EBE38]" . "3"^^ . "Szendiuch, Ivan" . "Wire-Bonds Durability in High-Temperature Applications"@en . . . "This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software." . . . "978-80-214-4754-7" . "Wire-Bonds Durability in High-Temperature Applications" . . . "RIV/00216305:26220/13:PU103648" . "RIV/00216305:26220/13:PU103648!RIV14-MSM-26220___" . "26220" . . "This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software."@en . "Wire-Bonds Durability in High-Temperature Applications"@en . "S" . . . . "Electronic Devices and Systems - IMAPS CS International Conference 2013" .