. . . "Treatment of surface layers for bonding chip to glass test substrates."@en . . . . . . "Treatment of surface layers for bonding chip to glass test substrates."@en . "adhesion, bonding, chip, glass substrate, roughness"@en . "Vzhledem k n\u00EDzk\u00E9 odolnosti lepen\u00FDch spoj\u016F sklen\u011Bn\u00FDch substr\u00E1t\u016F v pr\u016Fb\u011Bhu myc\u00EDho procesu (ultrazvuk, tlakov\u00FD post\u0159ik) p\u0159i \u010Di\u0161t\u011Bn\u00ED elektronick\u00FDch sestav po procesu p\u00E1jen\u00ED je nutn\u00E9 zv\u00FD\u0161it p\u0159ilnavost lepidla ke sklen\u011Bn\u00E9 vrstv\u011B distan\u010Dn\u00EDch pra\u017Ec\u016F jejich zdrsn\u011Bn\u00EDm. Pro tyto \u00FA\u010Dely byla vyvinuta metoda zdrs\u0148ov\u00E1n\u00ED povrchu vp\u00E1len\u00EDm teplotn\u011B odoln\u00E9ho pr\u00E1\u0161ku do povrchov\u00E9 natisknut\u00E9 vrstvy." . . "Jankovsk\u00FD, Jaroslav" . "[2925AFC2B8CC]" . "Bur\u0161\u00EDk, Martin" . "176159" . "3"^^ . . . "Funk\u010Dn\u00ED vzorek je vyu\u017E\u00EDv\u00E1n na pracovi\u0161ti \u0159e\u0161itele \u00DAstav mikroelektroniky, FEKT, VUT v Brn\u011B, Technick\u00E1 3058/10, 616 00 Brno, \u010Cesk\u00E1 republika, I\u010C 00216305, DI\u010C CZ00216305. Tlou\u0161\u0165ka sklen\u011Bn\u00E9 vrstvy je cca 12um, jemnost zdrsn\u011Bn\u00ED se pohybuje kolem 10um, maxim\u00E1ln\u00ED velikost \u010D\u00E1stic je 25um. P\u0159ilnavost lepen\u00FDch \u010Dip\u016F se zv\u00FD\u0161ila cca 8x. Metoda je vyu\u017E\u00EDv\u00E1na v r\u00E1mci v\u00FDzkumn\u00E9ho projektu NOMEN a v sou\u010Dasnosti je provozn\u011B ov\u011B\u0159ov\u00E1na pro pr\u016Fmyslov\u00E9 nasazen\u00ED v r\u00E1mci p\u0159\u00EDpravy testovac\u00EDch substr\u00E1t\u016F (PBT, SIEMENS, ZESTRON). P\u0159ihl\u00E1\u0161eno k patentov\u00E1n\u00ED." . "RIV/00216305:26220/12:PR26434!RIV13-TA0-26220___" . "Vzhledem k n\u00EDzk\u00E9 odolnosti lepen\u00FDch spoj\u016F sklen\u011Bn\u00FDch substr\u00E1t\u016F v pr\u016Fb\u011Bhu myc\u00EDho procesu (ultrazvuk, tlakov\u00FD post\u0159ik) p\u0159i \u010Di\u0161t\u011Bn\u00ED elektronick\u00FDch sestav po procesu p\u00E1jen\u00ED je nutn\u00E9 zv\u00FD\u0161it p\u0159ilnavost lepidla ke sklen\u011Bn\u00E9 vrstv\u011B distan\u010Dn\u00EDch pra\u017Ec\u016F jejich zdrsn\u011Bn\u00EDm. Pro tyto \u00FA\u010Dely byla vyvinuta metoda zdrs\u0148ov\u00E1n\u00ED povrchu vp\u00E1len\u00EDm teplotn\u011B odoln\u00E9ho pr\u00E1\u0161ku do povrchov\u00E9 natisknut\u00E9 vrstvy."@cs . "\u00DAprava povrchov\u00E9 vrstvy pro lepen\u00ED \u010Dip\u016F na sklen\u011Bn\u00E9 testovac\u00ED substr\u00E1ty."@cs . . . "3"^^ . . . "\u00DAprava povrchov\u00E9 vrstvy pro lepen\u00ED \u010Dip\u016F na sklen\u011Bn\u00E9 testovac\u00ED substr\u00E1ty." . "\u00DAprava povrchov\u00E9 vrstvy pro lepen\u00ED \u010Dip\u016F na sklen\u011Bn\u00E9 testovac\u00ED substr\u00E1ty."@cs . . . . "Vzhledem k osmin\u00E1sobn\u00E9mu zv\u00FD\u0161en\u00ED \u017Eivotnosti testovac\u00EDch substr\u00E1t\u016F dojde p\u0159i opakovan\u00FDch testech k v\u00FDrazn\u00FDm ekonomick\u00FDm \u00FAspor\u00E1m. P\u0159edpokl\u00E1dan\u00E1 cena jednoho substr\u00E1tu je cca 250,-K\u010D." . . "RIV/00216305:26220/12:PR26434" . "Poskl\u00EDv\u00E1n\u00ED" . "\u00DAprava povrchov\u00E9 vrstvy pro lepen\u00ED \u010Dip\u016F na sklen\u011Bn\u00E9 testovac\u00ED substr\u00E1ty." . "26220" . . . "Due to the low resistance of bonded joints glass substrate during the washing process (ultrasound, pressure spraying) when cleaning electronic assemblies after soldering process is necessary to increase the adhesion of the adhesive to the glass layer spacing of sleepers roughening. For this purpose a method has been developed surface roughening vp\u00E1len\u00EDm temperature resistant powder natisknut\u00E9 surface layer."@en . "http://www.umel.feec.vutbr.cz/vyzkum/vysledky/poloprovozy/bursik-pp-uprava-povrchove-vrstvy-pro-lepen-cipu-na-sklenene-testovaci-substraty.pdf" . . "\u0158ezn\u00ED\u010Dek, Michal" . . . "P(TA01011754)" .