"RIV/00216305:26220/12:PR26433" . "P(TA01011754)" . "Obdobn\u00E9 za\u0159\u00EDzen\u00ED pl\u00E1novan\u00E9 pro tento \u00FA\u010Del (s hor\u0161\u00EDmi parametry) se cenov\u011B pohybuje cca na 150tis. K\u010D. V\u00FDrobn\u00ED cena za\u0159\u00EDzen\u00ED vyvinut\u00E9ho na VUT se pohybuje kolem 35.000,-K\u010D p\u0159i dokonalej\u0161\u00EDm rozli\u0161en\u00ED zbytk\u016F tavidla. P\u0159i automatick\u00E9m provozu je pot\u0159eba zakoupit speci\u00E1ln\u00ED software vyvinut\u00FD ve spolupr\u00E1ci s VUT v cenov\u00E9 relaci 80.000,-K\u010D." . "Evaluation of residual contamination substrates"@en . . "Funk\u010Dn\u00ED vzorek je vyu\u017E\u00EDv\u00E1n na pracovi\u0161ti \u0159e\u0161itele \u00DAstav mikroelektroniky, FEKT, VUT v Brn\u011B, Technick\u00E1 3058/10, 616 00 Brno, \u010Cesk\u00E1 republika, I\u010C 00216305, DI\u010C CZ00216305 a na pracovi\u0161ti spole\u010Dnosti PBT Ro\u017Enov p.R., s.r.o., Lesn\u00ED 2331, 756 61 Ro\u017Enov pod Radho\u0161t\u011Bm, \u010Cesk\u00E1 republika, I\u010C 47972769 Za\u0159\u00EDzen\u00ED m\u00E1 rozli\u0161en\u00ED 16MPix, v re\u00E1lu zobrazuje pixel 25,4um plochy skute\u010Dn\u00E9ho objektu. Za\u0159\u00EDzen\u00ED je pou\u017E\u00EDv\u00E1no pro v\u011Bdecko-v\u00FDzkumn\u00E9 aktivity v r\u00E1mci projektu NOMEN a provozn\u011B ov\u011B\u0159ov\u00E1no z d\u016Fvodu nasazen\u00ED u z\u00E1kazn\u00EDk\u016F spole\u010Dnosti PBT Ro\u017Enov p.R." . . . . . "Evaluation of residual contamination substrates"@en . . "3"^^ . . "178893" . . "VYZKO - K01" . . . . "3"^^ . . "Bur\u0161\u00EDk, Martin" . . "Vyhodnocen\u00ED zbytkov\u00E9 kontaminace substr\u00E1t\u016F"@cs . "Vyhodnocen\u00ED zbytkov\u00E9 kontaminace substr\u00E1t\u016F"@cs . . "Za\u0159\u00EDzen\u00ED se vyu\u017E\u00EDv\u00E1 pro vyhodnocen\u00ED zbytkov\u00E9 kontaminace zku\u0161ebn\u00EDch sklen\u011Bn\u00FDch substr\u00E1t\u016F slou\u017E\u00EDc\u00EDch ke zji\u0161\u0165ov\u00E1n\u00ED parametr\u016F myc\u00EDho procesu \u010Di\u0161t\u011Bn\u00ED desek plo\u0161n\u00FDch spoj\u016F po procesu p\u00E1jen\u00ED."@cs . . "26220" . "Vyhodnocen\u00ED zbytkov\u00E9 kontaminace substr\u00E1t\u016F" . "Vyhodnocen\u00ED zbytkov\u00E9 kontaminace substr\u00E1t\u016F" . "Evaluation, contamination, substrates"@en . "The equipment is used for the evaluation of residual contamination test glass substrates used to identify parameters of the cleaning process, cleaning printed circuit boards after the soldering process."@en . . "http://www.umel.feec.vutbr.cz/vyzkum/vysledky/funkcni-vzorky/bursik-fv-vyhodnoceni-zbytkove-kontaminace-substratu.pdf" . "RIV/00216305:26220/12:PR26433!RIV13-TA0-26220___" . . "Za\u0159\u00EDzen\u00ED se vyu\u017E\u00EDv\u00E1 pro vyhodnocen\u00ED zbytkov\u00E9 kontaminace zku\u0161ebn\u00EDch sklen\u011Bn\u00FDch substr\u00E1t\u016F slou\u017E\u00EDc\u00EDch ke zji\u0161\u0165ov\u00E1n\u00ED parametr\u016F myc\u00EDho procesu \u010Di\u0161t\u011Bn\u00ED desek plo\u0161n\u00FDch spoj\u016F po procesu p\u00E1jen\u00ED." . "\u0158ezn\u00ED\u010Dek, Michal" . . "[C400198FBEEC]" . . . . . "Jankovsk\u00FD, Jaroslav" .