. . "[C956392E2DD7]" . . "5" . . . "Electronics" . "BG - Bulharsk\u00E1 republika" . "Testing of Novel Device for Anodic Bonding process in MEMS Application" . . . "5"^^ . "H\u00E1ze, Ji\u0159\u00ED" . . "Vrba, Radim\u00EDr" . . . "RIV/00216305:26220/11:PU93800!RIV12-MSM-26220___" . . . "5"^^ . . . . "2" . "1313-1842" . . . "Testing of Novel Device for Anodic Bonding process in MEMS Application"@en . "P(2A-1TP1/143), P(GA102/09/1601), S, Z(MSM0021630503)" . . "Mag\u00E1t, Martin" . . . . "The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass"@en . . "234918" . . "26220" . "Testing of Novel Device for Anodic Bonding process in MEMS Application"@en . . "3"^^ . "The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass" . "Pek\u00E1rek, Jan" . "RIV/00216305:26220/11:PU93800" . "Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test."@en . "Testing of Novel Device for Anodic Bonding process in MEMS Application" . "Pavl\u00EDk, Michal" .