. "26220" . "Novpress" . . . "Solder Balls, BGA"@en . "RIV/00216305:26220/10:PU90221" . "The Application of Solder Balls in 3D Packaging"@en . . "Pou\u017Eit\u00ED p\u00E1jec\u00EDch kuli\u010Dek v 3D pouzd\u0159en\u00ED" . "Brno" . "Brno" . . "The Application of Solder Balls in 3D Packaging"@en . "Nic\u00E1k, Michal" . . "2010-12-14+01:00"^^ . . . "978-80-214-4229-0" . "RIV/00216305:26220/10:PU90221!RIV11-GA0-26220___" . . "Mikrosyn. Nov\u00E9 trendy v mikroelektonick\u00FDch syst\u00E9mech a nanotechnologi\u00EDch" . "Pou\u017Eit\u00ED p\u00E1jec\u00EDch kuli\u010Dek v 3D pouzd\u0159en\u00ED"@cs . "Pou\u017Eit\u00ED p\u00E1jec\u00EDch kuli\u010Dek v 3D pouzd\u0159en\u00ED" . "280545" . . . "8"^^ . . "This article deals with production and application of solder balls and solder bumps ."@en . . . "2"^^ . "Prace se zabyva vyrobou a aplikaci pajecich kulicek a bumpu pro pouziti pri pouzdreni."@cs . "[A7EF21708A32]" . . . "Prace se zabyva vyrobou a aplikaci pajecich kulicek a bumpu pro pouziti pri pouzdreni." . "P(GA102/09/1701), Z(MSM0021630503)" . . "2"^^ . "Pou\u017Eit\u00ED p\u00E1jec\u00EDch kuli\u010Dek v 3D pouzd\u0159en\u00ED"@cs . . "Szendiuch, Ivan" .