"RIV/00216305:26220/10:PU89921!RIV11-MSM-26220___" . . "Testing and Simulation of Wire Bonding Attach for higher Current"@en . "Electronics System Integration Technology Conference ESTC 2010 in Berlin" . . . . . . "Testing and Simulation of Wire Bonding Attach for higher Current" . . "Bur\u0161\u00EDk, Martin" . "Neuveden" . "Berlin" . "[D196475A9F54]" . . . "This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology."@en . "Jankovsk\u00FD, Jaroslav" . "5"^^ . . . . "Berl\u00EDn, N\u011Bmecko" . "This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology." . . "4"^^ . "Hej\u00E1tkov\u00E1, Edita" . "978-1-4244-8555-0" . "Novotn\u00FD, Marek" . "Testing and Simulation of Wire Bonding Attach for higher Current" . "Testing and Simulation of Wire Bonding Attach for higher Current"@en . "26220" . "4"^^ . . . . . "S, Z(MSM0021630503)" . . "Szendiuch, Ivan" . "RIV/00216305:26220/10:PU89921" . "Testing, current load, wire bonding, simulation"@en . "2010-09-13+02:00"^^ . . . "292464" . .