"Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations" . "RIV/00216305:26220/10:PU88231" . "Nic\u00E1k, Michal" . . . "Szendiuch, Ivan" . . . "Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations"@en . . "8" . "RIV/00216305:26220/10:PU88231!RIV11-GA0-26220___" . "2"^^ . "PLUS" . "2010" . "2"^^ . "On the Application of Solder Balls for 3D Packaging"@en . . . "On the Application of Solder Balls for 3D Packaging" . "26220" . . . "1436-7505" . "P(GA102/09/1701), S, Z(MSM0021630503)" . . "DE - Spolkov\u00E1 republika N\u011Bmecko" . . . . . . . . "On the Application of Solder Balls for 3D Packaging"@en . "solder ball, soldering, 3D configuration, 3D packaging"@en . . . "6"^^ . . "276822" . "[BD64AC35DFED]" . "On the Application of Solder Balls for 3D Packaging" .