"This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls."@en . "Second Forum of Young Researchers. In the framework of International Forum %22Education Quality - 2010%22 : Proceedings" . "[1A129CDC85BA]" . . . . . . . . "Nic\u00E1k, Michal" . . "26220" . "CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES"@en . "CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES" . "Publishing House of ISTU" . "RIV/00216305:26220/10:PU87238!RIV11-GA0-26220___" . . "Izhevsk, Russia" . . . "2010-04-21+02:00"^^ . "P(GA102/09/1701), S, Z(MSM0021630503)" . . . . . "252015" . "CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES"@en . "RIV/00216305:26220/10:PU87238" . "2"^^ . "Szendiuch, Ivan" . "This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls." . . . . . "CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES" . "Izhevsk" . . "444"^^ . "978-5-7526-0442-3" . "packaging, stacking, 3D structures, lead-free, thick-film"@en . . "2"^^ . .