"Z(MSM0021630503)" . . "359594" . . . "2"^^ . "Budapest" . "RIV/00216305:26220/08:PU74272!RIV10-MSM-26220___" . . . "Szendiuch, Ivan" . . "LTCC, via, resistance, laser drilling, via metallisation"@en . . "Budapest, Hungary" . "978-963-06-4915-5" . . "RIV/00216305:26220/08:PU74272" . "Characterization of Laser Drilled Via Interconnections in LTCC Substrates"@en . "Characterization of Laser Drilled Via Interconnections in LTCC Substrates"@en . "2"^^ . . . "2"^^ . "Characterization of Laser Drilled Via Interconnections in LTCC Substrates" . . . "2008-05-07+02:00"^^ . "[F219408E6FC9]" . . . "Mesterprint Printinghouse Ltd." . "Van\u011Bk, Jan" . . "Characterization of Laser Drilled Via Interconnections in LTCC Substrates" . . . "This paper deals with analyses of laser-machined vias in LTCC (Low Temperature Cofired Ceramics)-substrates with regard to geometrical performance of holes and electrical characteristics of metalized vias."@en . . "ISSE 2008 Abstract Proceedings" . "This paper deals with analyses of laser-machined vias in LTCC (Low Temperature Cofired Ceramics)-substrates with regard to geometrical performance of holes and electrical characteristics of metalized vias." . . "26220" .