"MIKROSYN. Nov\u00E9 trendy v mikroelektronick\u00FDch syst\u00E9mech a nanotechnologi\u00EDch.. Semin\u00E1\u0159 o v\u00FDsledc\u00EDch v\u00FDzkumn\u00E9ho z\u00E1m\u011Bru MSM 0021630503 v roce 2007. Sborn\u00EDk p\u0159\u00EDsp\u011Bvk\u016F." . . "26220" . "378546" . . . "Article describes measuring of thermomechanical reliability of chip components in 2512 package"@en . . . "2"^^ . "M\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v povrchov\u00E9 mont\u00E1\u017Ei" . "[E0CFACD0A3A1]" . . "\u0160andera, Josef" . . "2"^^ . . "\u010Cl\u00E1nek popisuje v\u00FDsledky m\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti cipov\u00FDch resistor\u016F v pouzd\u0159e 2512"@cs . "RIV/00216305:26220/08:PU71587!RIV10-MSM-26220___" . . "Measuring of Thermomechanical Reliability of LF Soder Joint in Surface Mount Technology"@en . . "Measuring of Thermomechanical Reliability of LF Soder Joint in Surface Mount Technology"@en . "978-80-214-3534-6" . "Z(MSM0021630503)" . "\u0160vecov\u00E1, Olga" . "2007-12-14+01:00"^^ . "\u010Cl\u00E1nek popisuje v\u00FDsledky m\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti cipov\u00FDch resistor\u016F v pouzd\u0159e 2512" . "Brno" . . . "Brno" . . . "Ing. Zden\u011Bk Novotn\u00FD CSc." . "RIV/00216305:26220/08:PU71587" . "6"^^ . "M\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v povrchov\u00E9 mont\u00E1\u017Ei" . . "thermomechanical reliability, chip component , testing board, failure indication"@en . . . "M\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v povrchov\u00E9 mont\u00E1\u017Ei"@cs . "M\u011B\u0159en\u00ED termomechanick\u00E9 spolehlivosti bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v povrchov\u00E9 mont\u00E1\u017Ei"@cs . "\u0160vecov\u00E1, Olga" .