"RIV/00216305:26220/07:PU67661" . "reliability of solder joint, footprint, surface finishing, crack"@en . "Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly" . "Cluj-Napoca" . "76-77" . . "It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized"@en . "Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly"@en . . . "EDITURA MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1" . "Termomrchanick\u00E1 spolehlivost bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v SMT mont\u00E1\u017Ei"@cs . "978-973-713-174-4" . . "Termomrchanick\u00E1 spolehlivost bezolovnat\u00E9ho p\u00E1jen\u00E9ho spoje v SMT mont\u00E1\u017Ei"@cs . "It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized" . . . "ISSE 2007, 30th. International Spring Seminar on Electronics Technology, Abstracts Proceedings" . "Z(MSM0021630503)" . . . "Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly" . . "26220" . "P\u0159\u00EDsp\u011Bv\u011Bk popisuje praktick\u00E9 m\u011B\u0159en\u00ED spolehlivosti povrchov\u011B montovan\u00FDch sou\u010D\u00E1stek pro r\u016Fzn\u00E9 rozm\u011Bry plo\u0161ek a povrchov\u00E9 \u00FApravu dcesek plo\u0161n\u00FDch spoj\u016F."@cs . . "1"^^ . . . . "1"^^ . . "Cluj-Napoca, Romania" . . "2"^^ . "RIV/00216305:26220/07:PU67661!RIV08-MSM-26220___" . . . "2007-05-09+02:00"^^ . "[419187EB5090]" . "455093" . "Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly"@en . "\u0160andera, Josef" .