. . "Szendiuch, Ivan" . "Lead Free Solder Material Compatibility and Technological Factors" . "This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study"@en . . . "Lead Free Solder Material Compatibility and Technological Factors"@en . "Wiener Neustadt" . "Lead Free Solder Material Compatibility and Technological Factors"@en . "Neuveden" . "[A3569A9B2301]" . . "Lead Free Solder Material Compatibility and Technological Factors" . . "lead free, solderability, wettability, surface finish, flux, DOE"@en . . "0-7803-9325-2" . "527870" . . . . . "Tento \u010Dl\u00E1nek se zab\u00FDv\u00E1 v\u00FDzkumem nan\u00E1\u0161en\u00ED bezolovnat\u00E9 p\u00E1jky a jej\u00ED n\u00E1sledn\u00E9 sm\u00E1\u010Divosti b\u011Bhem p\u00E1jec\u00EDho procesu. V experimentu se porovn\u00E1vaj\u00ED p\u00E1jky SA a SAC s olovnatou p\u00E1jkou SnPb. Pro vyhodnocen\u00ED v\u00FDsledk\u00FA t\u00E9to studie byla pou\u017Eita metoda DOE."@cs . . . . "RIV/00216305:26220/05:PU50169!RIV06-GA0-26220___" . . "This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study" . "2005-05-19+02:00"^^ . . . "Vienna" . . . "Star\u00FD, Ji\u0159\u00ED" . "78-83" . "26220" . "Kompatibilita bezolovnat\u00FDch p\u00E1jek a jejich technologick\u00E9 vlastnosti"@cs . "Kompatibilita bezolovnat\u00FDch p\u00E1jek a jejich technologick\u00E9 vlastnosti"@cs . "Conference Proceedings ISSE 2005" . "P(GA102/04/0590), Z(MSM0021630503)" . . "6"^^ . "2"^^ . "RIV/00216305:26220/05:PU50169" . . . "2"^^ .