. . "Lanskroun" . . "578344" . "This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading." . . . . . "Prague" . . "[6E7CB830336D]" . "80-239-2835-X" . "Optimizing of Solder Joint Reliability by 3D Modeling" . "This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading."@en . "solder joint reliability, modelling, ANSYS"@en . . "Optimizing of Solder Joint Reliability by 3D Modeling" . "Optimizing of Solder Joint Reliability by 3D Modeling"@en . "2004-06-16+02:00"^^ . "Optimizing of Solder Joint Reliability by 3D Modeling"@en . . . "Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani"@cs . "Bulva, Jind\u0159ich" . "2"^^ . "195-394" . "Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition" . "Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani"@cs . "P\u0159\u00EDsp\u011Bvek je zam\u011B\u0159en na termomechanik\u00E9 modelov\u00E1n\u00ED dvou substr\u00E1t\u016F s r\u016Fzn\u00FDm CTE. Jedn\u00EDm z materi\u00E1l\u016F je lamin\u00E1t FR4, druh\u00FDm je keramika 96% Al2O3. Spojen\u00ED substr\u00E1t\u016F je zaji\u0161t\u011Bno pomoc\u00ED spoj\u016F realizovan\u00FDch bezolovnatou p\u00E1jkou SnAgCu. C\u00EDlem je popsat vliv rozm\u011Br\u016F a tvaru p\u00E1jen\u00FDch spoj\u016F na mechanick\u00E9 nap\u011Bt\u00ED v struktu\u0159e vznikaj\u00EDc\u00ED."@cs . "2"^^ . . . . "26220" . "IMAPS CZ&SK Chapter" . . . "RIV/00216305:26220/04:PU43642" . "RIV/00216305:26220/04:PU43642!RIV06-GA0-26220___" . . . . "200"^^ . "Szendiuch, Ivan" . "P(GA102/04/0590), Z(MSM 262200022)" .