"Ing. Zden\u011Bk Novotn\u00FD CSc." . "RIV/00216305:26220/02:PU29151" . "4"^^ . "As today\u2019s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from severall ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates." . . . "B\u00EDlek, Jarom\u00EDr" . . . "RIV/00216305:26220/02:PU29151!RIV/2003/MSM/262203/N" . "Thermomechanical Modelling of Multisubstrate Modules" . "As today\u2019s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from severall ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates."@en . "666950" . "26220" . . "230-233" . "Z(MSM 262200022)" . . . "Thermomechanical Modelling of Multisubstrate Modules"@en . "ANSYS modelling, MSM, thermomechanical properties"@en . . "2002-09-09+02:00"^^ . . "Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission" . . . "80-214-2180-0" . "[84833EE85075]" . . "Thermomechanical Modelling of Multisubstrate Modules" . "1"^^ . . "Brno" . "Brno" . "Thermomechanical Modelling of Multisubstrate Modules"@en . . . "0"^^ . . "1"^^ . "0"^^ .