"Kniha se zab\u00FDv\u00E1 popisem modern\u00EDch mont\u00E1\u017En\u00EDch technologi\u00ED pou\u017E\u00EDvan\u00FDch p\u0159i konstrukci elektronick\u00FDch syst\u00E9m\u016F. I kdy\u017E v sou\u010Dasn\u00E9 mikroelektronice m\u00E1 dominantn\u00ED postaven\u00ED polovodi\u010Dov\u00FD \u010Dip je nezbytn\u00E9 \u0159e\u0161it technologie spojen\u00E9 s jeho mont\u00E1\u017E\u00ED v\u010Detn\u011B pouzd\u0159en\u00ED,propojov\u00E1n\u00ED a tak\u00E9 konstruk\u010Dn\u00EDho uspo\u0159\u00E1d\u00E1n\u00ED cel\u00E9ho syst\u00E9mu. Proto je obsahem t\u00E9to knihy nejen \u0159e\u0161en\u00ED propojovac\u00EDch s\u00EDt\u00ED ale i pasivn\u00EDch prvk\u016F, vstup\u016F a v\u00FDstup\u016F (senzor\u016F a atenu\u00E1tor\u016F) a ve\u0161ker\u00FDch podp\u016Frn\u00FDch \u010D\u00E1st\u00ED. Popsan\u00E1 problematika navazuje na ve sv\u011Bt t\u011B nov\u011B vzniklou oblast naz\u00FDvanou Packaging & Interconnection."@cs . . . "Kniha se zab\u00FDv\u00E1 popisem modern\u00EDch mont\u00E1\u017En\u00EDch technologi\u00ED pou\u017E\u00EDvan\u00FDch p\u0159i konstrukci elektronick\u00FDch syst\u00E9m\u016F. I kdy\u017E v sou\u010Dasn\u00E9 mikroelektronice m\u00E1 dominantn\u00ED postaven\u00ED polovodi\u010Dov\u00FD \u010Dip je nezbytn\u00E9 \u0159e\u0161it technologie spojen\u00E9 s jeho mont\u00E1\u017E\u00ED v\u010Detn\u011B pouzd\u0159en\u00ED,propojov\u00E1n\u00ED a tak\u00E9 konstruk\u010Dn\u00EDho uspo\u0159\u00E1d\u00E1n\u00ED cel\u00E9ho syst\u00E9mu. Proto je obsahem t\u00E9to knihy nejen \u0159e\u0161en\u00ED propojovac\u00EDch s\u00EDt\u00ED ale i pasivn\u00EDch prvk\u016F, vstup\u016F a v\u00FDstup\u016F (senzor\u016F a atenu\u00E1tor\u016F) a ve\u0161ker\u00FDch podp\u016Frn\u00FDch \u010D\u00E1st\u00ED. Popsan\u00E1 problematika navazuje na ve sv\u011Bt t\u011B nov\u011B vzniklou oblast naz\u00FDvanou Packaging & Interconnection." . . . . "Technologie elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F"@cs . "The book deals with modern assembly technology methods and principles. Interconnection and Packaging are the main parts of discussed problematic."@en . "Technologie elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F" . "Microelectronics assembly technology"@en . . . . "Microelectronics assembly technology"@en . "26220" . "RIV/00216305:26220/02:PU29055" . "Ad\u00E1mek, Martin" . . . "80-214-2072-3" . . . "Technologie elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F" . . "Technologie elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F"@cs . "B\u00EDlek, Jarom\u00EDr" . . "[1B06D89E3A3F]" . "Szendiuch, Ivan" . . . . "GA102/00/0969" . . . "microelectronic technology, multichip modules, hybrid integrated circuits, SMT, soldering, quality, SPC, environment"@en . . "289"^^ . . "Vysok\u00E9 u\u010Den\u00ED technick\u00E9 v Brn\u011B. Nakladatelstv\u00ED VUTIUM" . "5"^^ . "5"^^ . "Malysz, Karel" . . . . "P(GA102/00/0969), Z(MSM 210000021), Z(MSM 262200022)" . "RIV/00216305:26220/02:PU29055!RIV06-GA0-26220___" . "289"^^ . . "666478" . "Pr\u00E1\u0161ek, Jan" . . . "Technologie elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F" . "Brno" .