"14310" . . "Bur\u0161\u00EDk, Ji\u0159\u00ED" . "Scanning thermal microscopy"@en . "3"^^ . "Scanning thermal microscopy - theory and applications"@en . "3"^^ . "50" . "3"^^ . "RIV/00216224:14310/05:00013549" . . . . . . . . "In this article the theoretical background and some results of the scanning thermal microscopy analysis of artifical structures such as microchip surfaces and solar cell contacts are presented. It is shown that at the absence of surface roughness the SThM can be used to obtain reliable material contrast images. However, roughness and other topographical features can influence the thermal data in a strong way. It is illustrated that this effect can be partially removed by using neural network approach for modelling the thermal signal using the topography data. The illustration of this approach is presented in the analysis of geometry of the examples selected in this article."@en . "541913" . . . "RIV/00216224:14310/05:00013549!RIV10-MSM-14310___" . . "In this article the theoretical background and some results of the scanning thermal microscopy analysis of artifical structures such as microchip surfaces and solar cell contacts are presented. It is shown that at the absence of surface roughness the SThM can be used to obtain reliable material contrast images. However, roughness and other topographical features can influence the thermal data in a strong way. It is illustrated that this effect can be partially removed by using neural network approach for modelling the thermal signal using the topography data. The illustration of this approach is presented in the analysis of geometry of the examples selected in this article." . . . "Ohl\u00EDdal, Ivan" . "Jemn\u00E1 mechanika a optika" . . "Scanning thermal microscopy - theory and applications"@en . . . "Scanning thermal microscopy - theory and applications" . "[0B28A02B6FF1]" . "Klapetek, Petr" . . "0447-6441" . "P(FT-TA/094), Z(AV0Z20410507), Z(MSM0021622411)" . "CZ - \u010Cesk\u00E1 republika" . . "11-12" . "Scanning thermal microscopy - theory and applications" .