. "Three Sn-Cu based lead-free solders, in particular the near eutectic Sn-0,7 wt.%Cu, the Sn-1,4 wt.%Cu and the alloy with Ni addition Sn-0,6 wt.%Cu-0,0wt.%Ni were used in this investigation to study the growth kinetics of the intermetallic compounds formed at the interface of the liquid Sn-Cu based solder and the Cu substrate. Cu and Ni influence significantly and in a different way both the morphology and the kinetics of IMC growt." . "4"^^ . "Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate"@en . "11320" . "Sl\u00E1mov\u00E1, M." . "International Journal of Materials Research" . . "Three Sn-Cu based lead-free solders, in particular the near eutectic Sn-0,7 wt.%Cu, the Sn-1,4 wt.%Cu and the alloy with Ni addition Sn-0,6 wt.%Cu-0,0wt.%Ni were used in this investigation to study the growth kinetics of the intermetallic compounds formed at the interface of the liquid Sn-Cu based solder and the Cu substrate. Cu and Ni influence significantly and in a different way both the morphology and the kinetics of IMC growt."@en . . "Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate" . . . "1862-5282" . . . . "6" . . "RIV/00216208:11320/09:00206290!RIV10-MSM-11320___" . "[C102FE273B1D]" . "RIV/00216208:11320/09:00206290" . "Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate" . "320054" . . . "100" . . "000267933300015" . "Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate"@en . . "2"^^ . "P(1M0556)" . . "Harcuba, Petr" . . . . "3"^^ . "Jane\u010Dek, Milo\u0161" . "Intermetallic; compounds; interface; between; solders; substrate"@en . . . "DE - Spolkov\u00E1 republika N\u011Bmecko" .