"3"^^ . "Ov\u011B\u0159en\u00ED funk\u010Dnosti adhezivn\u00EDch syst\u00E9m\u016F V. a VI. generace pomoc\u00ED metody termocyklingu"@cs . "1"^^ . "C\u00EDlem studie bylo porovnat spolehlivost adhezivn\u00EDch syst\u00E9m\u016F V.a VI.generace pomoc\u00ED metody termocyklingu podle metodiky ISO/TS 11405:2003 (E). K porovn\u00E1n\u00ED byly vybr\u00E1ny dva z\u00E1stupci z ka\u017Ed\u00E9 skupiny ? z V.generace materi\u00E1ly Single Bond Adper a Prime&Bond NT a z VI.generace materi\u00E1ly Prompt ? L Pop Adper a Xeno III. Materi\u00E1ly V.generace byly kombinov\u00E1ny s doporu\u010Den\u00FDmi leptac\u00EDmi gely a u v\u0161ech adheziv bylo postupov\u00E1no striktn\u011B dle n\u00E1vodu na pou\u017Eit\u00ED. Adhezivn\u00ED syst\u00E9my byly kombinov\u00E1ny s materi\u00E1lem Spectrum TPH. Ka\u017Ed\u00FD adhezivn\u00ED syst\u00E9m byl testov\u00E1n na souboru 10 intaktn\u00EDch t\u0159et\u00EDch mol\u00E1r\u016F. V\u00FDsledky uk\u00E1zaly zna\u010Dn\u00FD rozptyl mezi spolehlivost\u00ED jednotliv\u00FDch adheziv bez z\u00E1vislosti na p\u0159\u00EDslu\u0161nosti k jednotliv\u00FDm generac\u00EDm, tj.self-etch nebo konven\u010Dn\u00ED total-etch. P\u0159i m\u011B\u0159en\u00ED mikro\u0161t\u011Brbiny za pomoc\u00ED kvantifikace dle ISO/TS 11405:2003 (E) se nejspolehliv\u011Bji osv\u011Bd\u010Dil Prime&Bond NT, kter\u00FD m\u011Bl sk\u00F3re jen 12, pot\u00E9 Xeno III se sk\u00F3re 26. Mezi spolehlivost\u00ED Single Bond Adper (sk\u00F3re 37) a Prompt L-Pop Adper (sk\u00F3re 38) neby"@cs . . "36-38" . . . "3"^^ . "CZ - \u010Cesk\u00E1 republika" . . . "Vambera, M." . "RIV/00216208:11120/07:00000403" . . "2" . . . "Goji\u0161ov\u00E1, Eva" . "1213-0613" . "Ov\u011B\u0159en\u00ED funk\u010Dnosti adhezivn\u00EDch syst\u00E9m\u016F V. a VI. generace pomoc\u00ED metody termocyklingu" . "Comparison of Reliability of V. and VI. Generation Adhesive Systeme by Thermocycling"@en . . . "11120" . "Ov\u011B\u0159en\u00ED funk\u010Dnosti adhezivn\u00EDch syst\u00E9m\u016F V. a VI. generace pomoc\u00ED metody termocyklingu" . . "[9B64B24E6B7D]" . "RIV/00216208:11120/07:00000403!RIV08-MZ0-11120___" . "107" . . "Comparison of Reliability of V. and VI. Generation Adhesive Systeme by Thermocycling"@en . "The target of study was to compare the reliability of adhesive systems of V. and VI. generation by thermocycling according to method ISO/TS 11405:2003 (E). For comparison were chosen two representative from each group ? from V.generation materials Single Bond Adper and Prime&Bond NT and from VI. generation materials Prompt-L Pop Adper and Xeno III. Materials of V.generation were combined with advised etching gels and by all adhesives the directions for use were strictly followed. Adhesive systems were combined with material Spectrum TPH. Each adhesive system was tested on 10 samples of intact third molars. Results showed extensive diffusion among reliability single adhesives without dependence to generations, that means self-etch or conventional total-etch. While measuring microleakage according to ISO/TS 11405:2003 (E) was the most reliable Prime&Bond NT, with score 12, than Xeno III with score 26. Between reliability of Single Bond Adper (score 37) and Prompt L-Pop Adper (score 38) there was"@en . "adhesive systems - thermocycling"@en . "Bradna, P." . "P(NR8055)" . "Ov\u011B\u0159en\u00ED funk\u010Dnosti adhezivn\u00EDch syst\u00E9m\u016F V. a VI. generace pomoc\u00ED metody termocyklingu"@cs . "440276" . "\u010Cesk\u00E1 stomatologie a praktick\u00E9 zubn\u00ED l\u00E9ka\u0159stv\u00ED" . . "C\u00EDlem studie bylo porovnat spolehlivost adhezivn\u00EDch syst\u00E9m\u016F V.a VI.generace pomoc\u00ED metody termocyklingu podle metodiky ISO/TS 11405:2003 (E). K porovn\u00E1n\u00ED byly vybr\u00E1ny dva z\u00E1stupci z ka\u017Ed\u00E9 skupiny ? z V.generace materi\u00E1ly Single Bond Adper a Prime&Bond NT a z VI.generace materi\u00E1ly Prompt ? L Pop Adper a Xeno III. Materi\u00E1ly V.generace byly kombinov\u00E1ny s doporu\u010Den\u00FDmi leptac\u00EDmi gely a u v\u0161ech adheziv bylo postupov\u00E1no striktn\u011B dle n\u00E1vodu na pou\u017Eit\u00ED. Adhezivn\u00ED syst\u00E9my byly kombinov\u00E1ny s materi\u00E1lem Spectrum TPH. Ka\u017Ed\u00FD adhezivn\u00ED syst\u00E9m byl testov\u00E1n na souboru 10 intaktn\u00EDch t\u0159et\u00EDch mol\u00E1r\u016F. V\u00FDsledky uk\u00E1zaly zna\u010Dn\u00FD rozptyl mezi spolehlivost\u00ED jednotliv\u00FDch adheziv bez z\u00E1vislosti na p\u0159\u00EDslu\u0161nosti k jednotliv\u00FDm generac\u00EDm, tj.self-etch nebo konven\u010Dn\u00ED total-etch. P\u0159i m\u011B\u0159en\u00ED mikro\u0161t\u011Brbiny za pomoc\u00ED kvantifikace dle ISO/TS 11405:2003 (E) se nejspolehliv\u011Bji osv\u011Bd\u010Dil Prime&Bond NT, kter\u00FD m\u011Bl sk\u00F3re jen 12, pot\u00E9 Xeno III se sk\u00F3re 26. Mezi spolehlivost\u00ED Single Bond Adper (sk\u00F3re 37) a Prompt L-Pop Adper (sk\u00F3re 38) neby" .