. "0"^^ . . "2015-02-09+01:00"^^ . . . . "In the year 2007 there were\u00A0in EU,including Czech Republic,introduced\u00A0RoHS and WEEE directives.That means all producers of electric equipments have to replace tin-lead solder materials with lead-free one.Up to now there are more alternatives (SnCuAg,SnCuetc.),but no one\u00A0has the same parameters.This project deals with research of lead-free soldering application with a view to reflow soldering process.The aim is optimizing\u00A0of solder process parameters,definition of process windows and solders pads dimensions,in context of solder joint structure and long time reliability.Solder joints shape and structure will be investigated in dependence on soldering parameters and design algorithms by factorial analyze.Progressive part of this project makes research of influence of additional non-thermal energy that will be investigated during reflow process with focus on solder structure formation and development of new soldering principles, all in accordance with RoHS,WEEE and EuP directives.The fact is"@en . "lead-free solder; reflow soldering; intermetalic layers; reliability; RoHS"@en . "Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability"@en . "Bylo prok\u00E1z\u00E1no, \u017Ee v procesu z\u00FA\u010Dastn\u011Bn\u00E9 materi\u00E1ly (p\u00E1jka, tavidlo, materi\u00E1ly kontakt\u016F) vz\u00E1jemn\u011B reaguj\u00ED s nastaven\u00EDm parametr\u016F procesu (teplotn\u00ED profil, atmosf\u00E9ra), tak\u017Ee v pr\u016Fb\u011Bhu p\u0159etaven\u00ED doch\u00E1z\u00ED k \u0159ad\u011B chemick\u00FDch reakc\u00ED a fyzik\u00E1ln\u00EDch d\u011Bj\u016F, kter\u00E9 ovliv\u0148uj\u00ED strukturu spoje. V\u00FDsledkem je fakt, \u017Ee se stejnou p\u00E1jkovou kompozic\u00ED aplikovanou za r\u016Fzn\u00FDch podm\u00EDnek je mo\u017En\u00E9"@cs . "Od roku 2007 jsou\u00A0zavedeny v\u00A0zem\u00EDch EU, v\u010Detn\u011B \u010CR, v\u00A0platnost normy RoHS\u00A0a WEEE. Z nich vypl\u00FDv\u00E1, \u017Ee v\u0161ichni v\u00FDrobci elektronick\u00FDch za\u0159\u00EDzen\u00ED mus\u00ED\u00A0nahradit SnPb p\u00E1jky p\u00E1jkami bezolovnat\u00FDmi. Dosud se objevila \u0159ada alternativn\u00EDch \u0159e\u0161en\u00ED\u00A0(SnCuAg, SnCu, SnAg atd), ale \u017E\u00E1dn\u00E9\u00A0nen\u00ED plnohodnotnou n\u00E1hradou,\u00A0jak z pohledu procesu (zpracov\u00E1n\u00ED), tak\u00A0vlastnost\u00ED (p\u0159edev\u0161\u00EDm spolehlivosti a \u017Eivotnosti). Projekt\u00A0je zam\u011B\u0159en na optimalizaci procesu p\u00E1jen\u00ED, resp. na nov\u00E9 mo\u017Enosti vedouc\u00ED ke zv\u00FD\u0161en\u00ED jakosti bezolovnat\u00FDch p\u00E1jen\u00FDch spoj\u016F s d\u016Frazem na aplikaci p\u0159\u00EDdavn\u00E9 netermick\u00E9 energie do\u00A0samotn\u00E9ho procesu p\u00E1jen\u00ED, je\u017E m\u016F\u017Ee ovlivnit strukturu spoje a s t\u00EDm i jeho vlastnosti. C\u00EDlem je stanoven\u00ED faktor\u016F vedouc\u00EDch k zaji\u0161t\u011Bn\u00ED vysok\u00E9 jakosti p\u00E1jen\u00FDch spoj\u016F, odstran\u011Bn\u00ED nehomogenit spoje a optimalizace cel\u00E9ho procesu za \u00FA\u010Delem zaji\u0161t\u011Bn\u00ED co nejdel\u0161\u00ED \u017Eivotnosti p\u00E1jen\u00FDch spoj\u016F, a to v\u00A0souladu s\u00A0normami RoHS, WEEE a EuP.Je\u00A0zn\u00E1mo, \u017Ee\u00A0\u017Eivotnost p\u00E1jen\u00FDch spoj\u016F SnPb je minim\u00E1ln\u011B 20 let a v\u00A0\u0159ad\u011B p\u0159\u00EDpad\u016F i v\u00EDce. Ale mechanizmus" . . . . " reliability" . . " intermetalic layers" . "2010-12-31+01:00"^^ . . . . "V\u00FDzkum a v\u00FDvoj nov\u00FDch princip\u016F p\u00E1jen\u00ED pro zv\u00FD\u0161en\u00ED spolehlivosti bezolovnat\u00FDch p\u00E1jen\u00FDch spoj\u016F" . . "21"^^ . "GA102/09/1701" . "21"^^ . "http://www.isvav.cz/projectDetail.do?rowId=GA102/09/1701"^^ . . "2009-01-01+01:00"^^ . . . . "It was agreed in the soldering process involved materials (solder, flux, pads) are in the reaction with process parameters (temperature profile, ambient). During reflow are running many chemical reactions and processes that influence final solder joint structure. That all results the facts solder joint quality realized at the same solder composition can achieve different results. Experiments have"@en . "2010-04-16+02:00"^^ . "lead-free solder" . "0"^^ . . "1"^^ . . " reflow soldering" . .