"It is necessary to respect present development of electronic circuits, especially in regarding to technical and economical aspects. Technicians and managers at all positions have to understand this situation in the widest context. The objective of this project is to find a new technical solutions usable for construction of electronic systems especially for passive networks of MCM and MSM. The project is focused on research, development and production of passive networks for MCM and MSM using both, ceramic and laminate, substrates. Aplication of CSP with Flip Chip semiconductoirs makes a part of this work too. At the same time a study of thermal management using ANSYS and an improvement in quality through SPC makes a part of work, which is closed to construction of MCM and MSM. The project deals with modem solution in the technology of microelectronics and preparing specialists of all levels for new trends in this area through international conferences, seminars and workshops. A scientific"@en . . . . "2007-10-16+02:00"^^ . . . "GA102/04/0590" . . . . "Development of microelectronics technologies for 3D circuits and systems"@en . "Projekt \u0159e\u0161\u00ED aktu\u00E1ln\u00ED problematiku z oblasti pokrokov\u00FDch mikroelektronick\u00FDch mont\u00E1\u017En\u00EDch technologi\u00ED (dle definice IMAPS v\u0161e od \u010Dipu a\u017E po syst\u00E9m), je\u017E vedou k dosa\u017Een\u00ED miniaturizace, v\u010Detn\u011B pouzd\u0159en\u00ED ve t\u0159et\u00EDm rozm\u011Bru (3D).\u00A0V\u00FDsledky jsou uvedeny ve t\u0159ech"@cs . . . "http://www.isvav.cz/projectDetail.do?rowId=GA102/04/0590"^^ . "Respektov\u00E1n\u00ED sou\u010Dasn\u00E9ho v\u00FDvoje elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F, jen\u017E je st\u00E1le v\u00EDce v\u00E1z\u00E1n spojen\u00EDm technick\u00FDch a ekonomick\u00FDch aspekt\u016F je nevyhnuteln\u00E9. Odborn\u00ED pracovn\u00EDci a mana\u017Ee\u0159i mus\u00ED tento v\u00FDvoj proto ch\u00E1pat ve st\u00E1le \u0161ir\u0161\u00EDm kontextu. Hlavn\u00EDm c\u00EDlem tohoto projektu je naj\u00EDt n\u011Bkter\u00E1 nov\u00E1 technick\u00E1 \u0159e\u0161en\u00ED pro konstrukci elektronick\u00FDch obvod\u016F a syst\u00E9m\u016F se zam\u011B\u0159en\u00EDm na v\u00FDvoj a v\u00FDrobu p\u0159edev\u0161\u00EDm pasivn\u00EDch s\u00EDt\u00ED pro multi\u010Dipov\u00E9 a multisubstr\u00E1tov\u00E9 moduly (MCM, MSM), je\u017E spojuj\u00ED pou\u017Eit\u00ED keramick\u00FDch a lamin\u00E1tov\u00FDch substr\u00E1t\u016F v jedin\u00E9 aplikaci. Podstatou je vyu\u017Eit\u00ED nevakuov\u00FDch proces\u016F, p\u0159edev\u0161\u00EDm s\u00EDtotisku pro realizaci kulov\u00FDch a hranov\u00FDch v\u00FDvod\u016F a n\u00E1sledn\u011B pak i pro konstrukci pouzder CSP s polovodi\u010Di Flip Chip. S t\u00EDm je spojeno i vytvo\u0159en\u00ED softwarov\u00FDch prost\u0159edk\u016F pro tepelnou anal\u00FDzu (ANSYS) a pro \u0159\u00EDzen\u00ED jakosti (SPC) v t\u011Bchto struktur\u00E1ch. Spole\u010Densk\u00FD v\u00FDznam je podtr\u017Een prezentac\u00ED nov\u00FDch poznatk\u016F a nov\u00FDch technologi\u00ED v\u010Detn\u011B jejich anal\u00FDz na tuzemsk\u00FDch i sv\u011Btov\u00FDch konferenc\u00EDch a tak\u00E9" . "1"^^ . "V\u00FDvoj mikroelektronick\u00FDch mont\u00E1\u017En\u00EDch technologi\u00ED pro 3D obvody a syst\u00E9my" . "63"^^ . "1"^^ . . "63"^^ . . . . . . "Neuvedeno."@en . . "0"^^ . . . "This project deals with investigation of modern microelectronics assembly technologies for 3D packaging. Results are arranged in three following parts:1) Research and development of technological processes for mounting, connecting and packaging of electr"@en .