"15"^^ . . "15"^^ . . "FR-TI1/072" . "Lead free soldering" . " water based fluxes" . "0"^^ . "http://www.isvav.cz/projectDetail.do?rowId=FR-TI1/072"^^ . " 3D electronic modules" . . . "V\u00FDvoj a realizace: 1) Moduly na keramice LTCC s p\u0159ipojen\u00EDm p\u0159es \u010Dipov\u00E9 SMD sou\u010D\u00E1stky, 2) Moduly na FR4, propojen\u00ED p\u0159es prokovan\u00E9 otvory, 3) Zkoum\u00E1n\u00ED sm\u00E1\u010Ditelnosti"@cs . "1"^^ . "The aim of project i a research of assembly techniques on the field opplication of 3D techniques, ecological lead free soldering and using of LTCC ceramic materials. Non-producing and producing institutions will cooperate on project. The project will technologically verified new methods of assembly electronic and microelectronic modules with automatic assembly machine and using standard technological procedures. Commonly will be solved methodology of %22green%22 lead free soldering with optimal design of printed boards for maximal reliability and minimum defects. Project also examines reliability of electronic assembly sets connected with leadfree solders."@en . "1"^^ . . "2011-12-31+01:00"^^ . . . . " thermochanical reliability" . . "Cilem projektu je v\u00FDzkum v oblasti mont\u00E1\u017En\u00EDch technologi\u00ED zam\u011B\u0159en\u00FD na aplikace 3D technologi\u00ED za pou\u017Eit\u00ED speci\u00E1ln\u00EDch keramick\u00FDch materi\u00E1l\u016F LTCC, ekologick\u00E9 bezolovnat\u00E9 p\u00E1jen\u00ED. Nev\u00FDrobn\u00ED a v\u00FDrobn\u00ED organizace se budou pod\u00EDlet na spole\u010Dn\u00E9m projektu. Budou technologicky odzkou\u0161eny nov\u00E9 zp\u016Fsoby mont\u00E1\u017Ee elektronick\u00FDch a mikroelektronick\u00FDch modul\u016F pomoc\u00ED osazovac\u00EDho automatu za pou\u017Eit\u00ED standardn\u00EDch osazovac\u00EDch a mont\u00E1\u017En\u00EDch stroj\u016F a technologick\u00FDch postup\u016F. Jedno z \u0159e\u0161en\u00ED je ji\u017E v sou\u010Dasn\u00E9 dobe pod\u00E1no jako pr\u016Fmyslov\u00FD vzor jeho\u017E vlastn\u00EDkem je VUT Brno. Spole\u010Dn\u011B bude technologicky rozpracovan\u00E1 %22zelen\u00E1%22metodika bezolovnat\u00E9ho p\u00E1jen\u00ED v elektronice. Sou\u010D\u00E1st\u00ED projektu bude v\u00FDzkum a vyhodnocov\u00E1n\u00ED spolehlivosti mont\u00E1\u017En\u00EDch sestav a bezolovnat\u00E9ho p\u00E1jen\u00ED t\u011Bchto i jin\u00FDch elektronick\u00FDch a mikroelektronick\u00FDch syst\u00E9m\u016F." . "Aplikace modern\u00EDch mont\u00E1\u017En\u00EDch technologi\u00ED a materi\u00E1l\u016F v elektrotechnick\u00E9m pr\u016Fmyslu" . "Lead free soldering; lead free solder SAC305; water based fluxes; wave sodering; reflow soldering; thermochanical reliability; wetting of solders; 3D electronic modules; bondig modules with base board; inserting machine; standard technique procedure"@en . "2011-05-10+02:00"^^ . . . "Research and realization: 1) Modules with LTCC ceramic with chip component interconnection, 2) Modules with FR4, connection with Modified, 3) Research of wettability"@en . . . " wave sodering" . . . . "2012-09-11+02:00"^^ . . " reflow soldering" . " wetting of solders" . " inserting machine" . "Use of Modern Assembly Techniques and Materials in Electronic Industry"@en . . " lead free solder SAC305" . " bondig modules with base board" . . "2009-03-01+01:00"^^ .